Third International Conference on Experimental Mechanics and third Conference of the Asian Committee on Experimental Mechanics

29 November-1 December 2004, Singapore

Verfasser / Beitragende:
Chenggen Quan ... [et al.] ; org. by National University of Singapore, Department of Mechanical Engineering (Singapore) ... [et al.] ; spons. by Lee Foundation (Singapore) ... [et al.]
Ort, Verlag, Jahr:
Bellingham, Washington : SPIE, 2005
Beschreibung:
2 vols.
Format:
Buch (Kongress)
ID: 16152852X