International Conference on Thin Film Physics and Applications

'91 TFPA : 15-17 April 1991, Shanghai, China

Verfasser / Beitragende:
spons. by Chinese Physical Society ... [et al.]
Ort, Verlag, Jahr:
Bellingham, Washington : SPIE, 1991
Beschreibung:
Online-Ressource
Format:
Buch (Kongress) (online)
Online Zugang:
ID: 192890883