cam a22 4 4500 357931769 CHVBK 20200930080403.0 140821s2015 xxu 10 eng|d 978-1-62332-263-2 soft cover 978-1-60768-620-0 PDF (OCoLC)945563207 (NEBIS)010605074 SzZuIDS NEBIS ETH-BIB ger rda Processing Materials of 3D Interconnects, Damascene, and Electronics Packaging Veranstaltung (6. 2014 Cancún) (DE-588)1088421008 Processing materials of 3D interconnects, damascene and electronics packaging 6 editors: K. Kondo (Osaka Prefecture University, Sakai, Osaka, Japan) [und 9 weitere] ; sponsoring divisions: Electronics and Photonics, Dielectric Science & Technology, Electrodeposition Pennington, NJ The Electrochemical Society [2015] vi, 132 Seiten Illustrationen Text txt rdacontent/ger ohne Hilfsmittel zu benutzen n rdamedia/ger Band nc rdacarrier/ger ECS transactions vol. 64, no. 40 64/40 Electronic materials and processing (NEBIS)005460664 165530405 The papers were presented in the symposium "Processing materials of 3D interconnects, damascene and electronics packaging 6", held during the 226th meeting of The Electrochemical Society, in Cacun, Mexico, October 5 to October 9, 2014. "This was a Joint International Meeting with Sociedad Mexicana de Electroquímica." FERTIGUNG IN DER ELEKTROTECHNIK, ELEKTRONIK, MIKRO-, NANOELEKTRONIK ger (ETHUDK)000051815 ethudk GEHÄUSE/MIKROELEKTRONIK ger (ETHUDK)000042604 ethudk LEITERPLATTEN + PLATINEN (MIKROELEKTRONIK) ger (ETHUDK)000028106 ethudk Konferenzschrift Cancún 2014 gnd-content u LEITERPLATTEN + PLATINEN (MIKROELEKTRONIK) ger 621.3.049.75 nebis E1 u FERTIGUNG IN DER ELEKTROTECHNIK, ELEKTRONIK, MIKRO-, NANOELEKTRONIK ger 621.3,3%658.51 nebis E1 u GEHÄUSE/MIKROELEKTRONIK ger 621.3.049.7,2 nebis E1 u PRINTED WIRING BOARDS, PWB + PRINTED CIRCUIT BOARDS, PCB (MICROELECTRONICS) eng 621.3.049.75 nebis E1 u CIRCUITS IMPRIMÉS + PLAQUETTES DE CIRCUITS IMPRIMÉS (MICROÉLECTRONIQUE) fre 621.3.049.75 nebis E1 u FABRICATION EN ÉLECTROTECHNIQUE, ÉLECTRONIQUE, MICROÉLECTRONIQUE, NANOÉLECTRONIQUE fre 621.3,3%658.51 nebis E1 u PRODUCTION IN ELECTRICAL ENGINEERING, ELECTRONICS, MICRO-, NANOELECTRONICS eng 621.3,3%658.51 nebis E1 u PACKAGING TECHNOLOGY (MICROELECTRONICS) eng 621.3.049.7,2 nebis E1 u TECHNOLOGIE DU BOÎTIER (MICROÉLECTRONIQUE) fre 621.3.049.7,2 nebis E1 Kondo K. Herausgeber edt Electrochemical Society (DE-588)342-6 Veranstalter orm Sociedad Mexicana de Electroquímica (DE-588)6061429-8 Veranstalter orm Electrochemical Society Electronics and Photonics Division (DE-588)6057340-5 Sponsor spn Electrochemical Society Dielectric Science and Technology Division (DE-588)5121104-X Sponsor spn Electrochemical Society Electrodeposition Division (DE-588)64581-3 Sponsor spn Electrochemical Society Meeting (226. 2014 Cancún) (DE-588)1085142809 BK020800 XK020000 XK020000 055 E01-20160314 NEBIS E16 E16 RH P T 1108: 64/40 NEBIS 111 2- Processing Materials of 3D Interconnects, Damascene, and Electronics Packaging Veranstaltung (6 2014 Cancún) (DE-588)1088421008 NEBIS 490 0- ECS transactions Electronic materials and processing vol. 64, no. 40 64/40 (NEBIS)005460664 165530405 NEBIS 700 1- Kondo K. Herausgeber edt NEBIS 710 2- Electrochemical Society (DE-588)342-6 Veranstalter orm NEBIS 710 2- Sociedad Mexicana de Electroquímica (DE-588)6061429-8 Veranstalter orm NEBIS 710 2- Electrochemical Society Electronics and Photonics Division (DE-588)6057340-5 Sponsor spn NEBIS 710 2- Electrochemical Society Dielectric Science and Technology Division (DE-588)5121104-X Sponsor spn NEBIS 710 2- Electrochemical Society Electrodeposition Division (DE-588)64581-3 Sponsor spn NEBIS 711 2- Electrochemical Society Meeting (226 2014 Cancún) (DE-588)1085142809 NEBIS EAD50 EBI01 E01 https://opac.nebis.ch/objects/pdf03/e01_978-1-62332-263-2_01.pdf Titelblatt und Inhaltsverzeichnis VIEW pdf SWISSBIB 324984774