Mechanical properties of electroformed copper layers with gradient microstructure

Verfasser / Beitragende:
[Qiang Liao, Li-qun Zhu, Hui-cong Liu, Wei-ping Li]
Ort, Verlag, Jahr:
2010
Enthalten in:
International Journal of Minerals, Metallurgy, and Materials, 17/1(2010-02-01), 69-74
Format:
Artikel (online)
ID: 445103167