Dissolution and Interface Reactions between Palladium and Tin (Sn)-Based Solders: Part I. 95.5Sn-3.9Ag-0.6Cu Alloy

Verfasser / Beitragende:
[Paul Vianco, Jerome Rejent, Gary Zender, Paul Hlava]
Ort, Verlag, Jahr:
2010
Enthalten in:
Metallurgical and Materials Transactions A, 41/12(2010-12-01), 3042-3052
Format:
Artikel (online)
ID: 445118237