Effect of Solder Thickness on Electromigration Behavior in Eutectic SnPb Solder Reaction Couples

Verfasser / Beitragende:
[Guangchen Xu, Fu Guo, Zhidong Xia, Yongping Lei, Yaowu Shi, Xiaoyan Li]
Ort, Verlag, Jahr:
2010
Enthalten in:
Journal of Materials Engineering and Performance, 19/5(2010-07-01), 616-622
Format:
Artikel (online)
ID: 445189886