caa a22 4500 445826312 CHVBK 20180317145300.0 cr unu---uuuuu 170323e20110101xx s 000 0 eng 10.1007/s10854-010-0082-2 doi (NATIONALLICENCE)springer-10.1007/s10854-010-0082-2 Effects of filler shape and size on the properties of silver filled epoxy composite for electronic applications [Elektronische Daten] [G. Suriati, M. Mariatti, A. Azizan] Epoxy composites filled with nano- and micro-sized silver (Ag) particulate fillers were prepared and characterized based on flexural properties, coefficient of thermal expansion, dynamic mechanical analysis, electrical conductivity, and morphological properties. The influences of these two types of Ag fillers, especially in terms of their sizes and shapes, were investigated. Silver nanoparticles were nano-sized and spherical, while silver flakes were micron-sized and flaky. It was found that the flexural strength of the epoxy composite filled with silver flakes decreased, while the flexural strength of the epoxy composite filled with silver nanoparticles showed an optimum value at 4 vol.% before it subsequently dropped. Both silver composites showed improvement in flexural modulus with increasing filler loads. CTE value indicated significant decrements in filled samples compared to neat epoxy. Results on the electrical conductivity of both systems showed a transition from insulation to conduction at 6 vol.%. Springer Science+Business Media, LLC, 2010 Suriati G. School of Materials and Mineral Resources Engineering, Engineering Campus, Universiti Sains Malaysia, 14300 Nibong Tebal, Seberang Prai Selatan, Penang, Malaysia aut Mariatti M. School of Materials and Mineral Resources Engineering, Engineering Campus, Universiti Sains Malaysia, 14300 Nibong Tebal, Seberang Prai Selatan, Penang, Malaysia aut Azizan A. School of Materials and Mineral Resources Engineering, Engineering Campus, Universiti Sains Malaysia, 14300 Nibong Tebal, Seberang Prai Selatan, Penang, Malaysia aut Journal of Materials Science: Materials in Electronics Springer US; http://www.springer-ny.com 22/1(2011-01-01), 56-63 0957-4522 22:1<56 2011 22 10854 https://doi.org/10.1007/s10854-010-0082-2 text/html Onlinezugriff via DOI 1 research-article jats NATIONALLICENCE 856 40 https://doi.org/10.1007/s10854-010-0082-2 text/html Onlinezugriff via DOI NATIONALLICENCE 700 1- Suriati G. School of Materials and Mineral Resources Engineering, Engineering Campus, Universiti Sains Malaysia, 14300 Nibong Tebal, Seberang Prai Selatan, Penang, Malaysia aut NATIONALLICENCE 700 1- Mariatti M. School of Materials and Mineral Resources Engineering, Engineering Campus, Universiti Sains Malaysia, 14300 Nibong Tebal, Seberang Prai Selatan, Penang, Malaysia aut NATIONALLICENCE 700 1- Azizan A. School of Materials and Mineral Resources Engineering, Engineering Campus, Universiti Sains Malaysia, 14300 Nibong Tebal, Seberang Prai Selatan, Penang, Malaysia aut NATIONALLICENCE 773 0- Journal of Materials Science: Materials in Electronics Springer US; http://www.springer-ny.com 22/1(2011-01-01), 56-63 0957-4522 22:1<56 2011 22 10854 Metadata rights reserved Springer special CC-BY-NC licence nationallicence BK010053 XK010053 XK010000 NATIONALLICENCE NATIONALLICENCE NL-springer