<?xml version="1.0" encoding="UTF-8"?>
<collection xmlns="http://www.loc.gov/MARC21/slim">
 <record>
  <leader>     caa a22        4500</leader>
  <controlfield tag="001">445826347</controlfield>
  <controlfield tag="003">CHVBK</controlfield>
  <controlfield tag="005">20180317145300.0</controlfield>
  <controlfield tag="007">cr unu---uuuuu</controlfield>
  <controlfield tag="008">170323e20110101xx      s     000 0 eng  </controlfield>
  <datafield tag="024" ind1="7" ind2="0">
   <subfield code="a">10.1007/s10854-010-0074-2</subfield>
   <subfield code="2">doi</subfield>
  </datafield>
  <datafield tag="035" ind1=" " ind2=" ">
   <subfield code="a">(NATIONALLICENCE)springer-10.1007/s10854-010-0074-2</subfield>
  </datafield>
  <datafield tag="245" ind1="0" ind2="0">
   <subfield code="a">Large-scale synthesis of silver nanowires via a solvothermal method</subfield>
   <subfield code="h">[Elektronische Daten]</subfield>
   <subfield code="c">[Dapeng Chen, Xueliang Qiao, Xiaolin Qiu, Jianguo Chen, Renzhi Jiang]</subfield>
  </datafield>
  <datafield tag="520" ind1="3" ind2=" ">
   <subfield code="a">Silver nanostructures have been synthesized through a simple solvothermal method by reducing silver nitrate (AgNO3) with ethylene glycol (EG) and using poly(vinylpyrrolidone) (PVP) as an adsorption agent. Different concentrations of ferric chloride (FeCl3) are added into the solution. It is found that AgCl colloids formed in the initial stage greatly influence the final morphologies of the products. When a low-concentration FeCl3 solution is used, there is a mixture of silver nanoparticles and nanowires. However, when a high-concentration FeCl3 solution (100μM) is used, large amounts of AgCl colloids appear, resulting in decreasing free Ag+ during initial formation of silver seeds and slowly releasing of Ag+ to the solution in the subsequent reaction. This leads to the formation of silver nanowires. Furthermore, an increase in the concentration of FeCl3 from 100 to 300μM results in the synthesis of silver nanowires with larger sizes. In addition, Fe(III) is reduced to Fe(II) form which in turn reacts with and removes adsorbed atomic oxygen from the surface of silver seeds. In this case, uniform silver nanowires can be obtained.</subfield>
  </datafield>
  <datafield tag="540" ind1=" " ind2=" ">
   <subfield code="a">Springer Science+Business Media, LLC, 2010</subfield>
  </datafield>
  <datafield tag="700" ind1="1" ind2=" ">
   <subfield code="a">Chen</subfield>
   <subfield code="D">Dapeng</subfield>
   <subfield code="u">State Key Laboratory of Plastic Forming Simulation and Die and Mould Technology, Huazhong University of Science and Technology, 430074, Wuhan, Hubei, People's Republic of China</subfield>
   <subfield code="4">aut</subfield>
  </datafield>
  <datafield tag="700" ind1="1" ind2=" ">
   <subfield code="a">Qiao</subfield>
   <subfield code="D">Xueliang</subfield>
   <subfield code="u">State Key Laboratory of Plastic Forming Simulation and Die and Mould Technology, Huazhong University of Science and Technology, 430074, Wuhan, Hubei, People's Republic of China</subfield>
   <subfield code="4">aut</subfield>
  </datafield>
  <datafield tag="700" ind1="1" ind2=" ">
   <subfield code="a">Qiu</subfield>
   <subfield code="D">Xiaolin</subfield>
   <subfield code="u">Nanomaterials Research Center, Nanchang Institute of Technology, 330013, Nanchang, Jiangxi, People's Republic of China</subfield>
   <subfield code="4">aut</subfield>
  </datafield>
  <datafield tag="700" ind1="1" ind2=" ">
   <subfield code="a">Chen</subfield>
   <subfield code="D">Jianguo</subfield>
   <subfield code="u">State Key Laboratory of Plastic Forming Simulation and Die and Mould Technology, Huazhong University of Science and Technology, 430074, Wuhan, Hubei, People's Republic of China</subfield>
   <subfield code="4">aut</subfield>
  </datafield>
  <datafield tag="700" ind1="1" ind2=" ">
   <subfield code="a">Jiang</subfield>
   <subfield code="D">Renzhi</subfield>
   <subfield code="u">State Key Laboratory of Plastic Forming Simulation and Die and Mould Technology, Huazhong University of Science and Technology, 430074, Wuhan, Hubei, People's Republic of China</subfield>
   <subfield code="4">aut</subfield>
  </datafield>
  <datafield tag="773" ind1="0" ind2=" ">
   <subfield code="t">Journal of Materials Science: Materials in Electronics</subfield>
   <subfield code="d">Springer US; http://www.springer-ny.com</subfield>
   <subfield code="g">22/1(2011-01-01), 6-13</subfield>
   <subfield code="x">0957-4522</subfield>
   <subfield code="q">22:1&lt;6</subfield>
   <subfield code="1">2011</subfield>
   <subfield code="2">22</subfield>
   <subfield code="o">10854</subfield>
  </datafield>
  <datafield tag="856" ind1="4" ind2="0">
   <subfield code="u">https://doi.org/10.1007/s10854-010-0074-2</subfield>
   <subfield code="q">text/html</subfield>
   <subfield code="z">Onlinezugriff via DOI</subfield>
  </datafield>
  <datafield tag="908" ind1=" " ind2=" ">
   <subfield code="D">1</subfield>
   <subfield code="a">research-article</subfield>
   <subfield code="2">jats</subfield>
  </datafield>
  <datafield tag="950" ind1=" " ind2=" ">
   <subfield code="B">NATIONALLICENCE</subfield>
   <subfield code="P">856</subfield>
   <subfield code="E">40</subfield>
   <subfield code="u">https://doi.org/10.1007/s10854-010-0074-2</subfield>
   <subfield code="q">text/html</subfield>
   <subfield code="z">Onlinezugriff via DOI</subfield>
  </datafield>
  <datafield tag="950" ind1=" " ind2=" ">
   <subfield code="B">NATIONALLICENCE</subfield>
   <subfield code="P">700</subfield>
   <subfield code="E">1-</subfield>
   <subfield code="a">Chen</subfield>
   <subfield code="D">Dapeng</subfield>
   <subfield code="u">State Key Laboratory of Plastic Forming Simulation and Die and Mould Technology, Huazhong University of Science and Technology, 430074, Wuhan, Hubei, People's Republic of China</subfield>
   <subfield code="4">aut</subfield>
  </datafield>
  <datafield tag="950" ind1=" " ind2=" ">
   <subfield code="B">NATIONALLICENCE</subfield>
   <subfield code="P">700</subfield>
   <subfield code="E">1-</subfield>
   <subfield code="a">Qiao</subfield>
   <subfield code="D">Xueliang</subfield>
   <subfield code="u">State Key Laboratory of Plastic Forming Simulation and Die and Mould Technology, Huazhong University of Science and Technology, 430074, Wuhan, Hubei, People's Republic of China</subfield>
   <subfield code="4">aut</subfield>
  </datafield>
  <datafield tag="950" ind1=" " ind2=" ">
   <subfield code="B">NATIONALLICENCE</subfield>
   <subfield code="P">700</subfield>
   <subfield code="E">1-</subfield>
   <subfield code="a">Qiu</subfield>
   <subfield code="D">Xiaolin</subfield>
   <subfield code="u">Nanomaterials Research Center, Nanchang Institute of Technology, 330013, Nanchang, Jiangxi, People's Republic of China</subfield>
   <subfield code="4">aut</subfield>
  </datafield>
  <datafield tag="950" ind1=" " ind2=" ">
   <subfield code="B">NATIONALLICENCE</subfield>
   <subfield code="P">700</subfield>
   <subfield code="E">1-</subfield>
   <subfield code="a">Chen</subfield>
   <subfield code="D">Jianguo</subfield>
   <subfield code="u">State Key Laboratory of Plastic Forming Simulation and Die and Mould Technology, Huazhong University of Science and Technology, 430074, Wuhan, Hubei, People's Republic of China</subfield>
   <subfield code="4">aut</subfield>
  </datafield>
  <datafield tag="950" ind1=" " ind2=" ">
   <subfield code="B">NATIONALLICENCE</subfield>
   <subfield code="P">700</subfield>
   <subfield code="E">1-</subfield>
   <subfield code="a">Jiang</subfield>
   <subfield code="D">Renzhi</subfield>
   <subfield code="u">State Key Laboratory of Plastic Forming Simulation and Die and Mould Technology, Huazhong University of Science and Technology, 430074, Wuhan, Hubei, People's Republic of China</subfield>
   <subfield code="4">aut</subfield>
  </datafield>
  <datafield tag="950" ind1=" " ind2=" ">
   <subfield code="B">NATIONALLICENCE</subfield>
   <subfield code="P">773</subfield>
   <subfield code="E">0-</subfield>
   <subfield code="t">Journal of Materials Science: Materials in Electronics</subfield>
   <subfield code="d">Springer US; http://www.springer-ny.com</subfield>
   <subfield code="g">22/1(2011-01-01), 6-13</subfield>
   <subfield code="x">0957-4522</subfield>
   <subfield code="q">22:1&lt;6</subfield>
   <subfield code="1">2011</subfield>
   <subfield code="2">22</subfield>
   <subfield code="o">10854</subfield>
  </datafield>
  <datafield tag="900" ind1=" " ind2="7">
   <subfield code="a">Metadata rights reserved</subfield>
   <subfield code="b">Springer special CC-BY-NC licence</subfield>
   <subfield code="2">nationallicence</subfield>
  </datafield>
  <datafield tag="898" ind1=" " ind2=" ">
   <subfield code="a">BK010053</subfield>
   <subfield code="b">XK010053</subfield>
   <subfield code="c">XK010000</subfield>
  </datafield>
  <datafield tag="949" ind1=" " ind2=" ">
   <subfield code="B">NATIONALLICENCE</subfield>
   <subfield code="F">NATIONALLICENCE</subfield>
   <subfield code="b">NL-springer</subfield>
  </datafield>
 </record>
</collection>
