caa a22 4500 445826428 CHVBK 20180317145300.0 cr unu---uuuuu 170323e20110101xx s 000 0 eng 10.1007/s10854-010-0075-1 doi (NATIONALLICENCE)springer-10.1007/s10854-010-0075-1 Effect of Bi content on spalling behavior of Sn-Bi-Zn-Ag/Cu interface [Elektronische Daten] [X. Wang, Y. Liu, Z. Gao] The effect of the Bi content on the formation of intermetallic compounds (IMCs) layers between the Sn-xBi-0.9Zn-0.3Ag lead-free solder (with x=1, 2, 3 and 4, in weight percent, hereafter) and Cu substrate was investigated. The structure of the IMC layer in the soldered interface varies apparently with increasing the Bi content. When the Bi content is 1 wt%, the interface soldered is consisted of CuZn and Cu6Sn5 IMC layers, which are separated by an intermediate solder layer. As the Bi content increases, the spalling phenomenon tends to disappear. Moreover, the layer between the Sn-2Bi-0.9Zn-0.3Ag solder and Cu substrate is thicker than others. The evolution of the soldered interfacial structure could be attributed to the existence of Bi. Springer Science+Business Media, LLC, 2010 Wang X. School of Materials Science & Engineering, Tianjin Key Laboratory of Advanced Jointing Technology, Tianjin University, 300072, Tianjin, People's Republic of China aut Liu Y. School of Materials Science & Engineering, Tianjin Key Laboratory of Advanced Jointing Technology, Tianjin University, 300072, Tianjin, People's Republic of China aut Gao Z. School of Materials Science & Engineering, Tianjin Key Laboratory of Advanced Jointing Technology, Tianjin University, 300072, Tianjin, People's Republic of China aut Journal of Materials Science: Materials in Electronics Springer US; http://www.springer-ny.com 22/1(2011-01-01), 14-19 0957-4522 22:1<14 2011 22 10854 https://doi.org/10.1007/s10854-010-0075-1 text/html Onlinezugriff via DOI 1 research-article jats NATIONALLICENCE 856 40 https://doi.org/10.1007/s10854-010-0075-1 text/html Onlinezugriff via DOI NATIONALLICENCE 700 1- Wang X. School of Materials Science & Engineering, Tianjin Key Laboratory of Advanced Jointing Technology, Tianjin University, 300072, Tianjin, People's Republic of China aut NATIONALLICENCE 700 1- Liu Y. School of Materials Science & Engineering, Tianjin Key Laboratory of Advanced Jointing Technology, Tianjin University, 300072, Tianjin, People's Republic of China aut NATIONALLICENCE 700 1- Gao Z. School of Materials Science & Engineering, Tianjin Key Laboratory of Advanced Jointing Technology, Tianjin University, 300072, Tianjin, People's Republic of China aut NATIONALLICENCE 773 0- Journal of Materials Science: Materials in Electronics Springer US; http://www.springer-ny.com 22/1(2011-01-01), 14-19 0957-4522 22:1<14 2011 22 10854 Metadata rights reserved Springer special CC-BY-NC licence nationallicence BK010053 XK010053 XK010000 NATIONALLICENCE NATIONALLICENCE NL-springer