caa a22 4500 445826568 CHVBK 20180317145301.0 cr unu---uuuuu 170323e20110601xx s 000 0 eng 10.1007/s10854-011-0291-3 doi (NATIONALLICENCE)springer-10.1007/s10854-011-0291-3 Recent advances on Sn-Cu solders with alloying elements: review [Elektronische Daten] [Guang Zeng, Songbai Xue, Liang Zhang, Lili Gao] Nowadays, a major concern of Sn-Cu based solder alloy today is focused on continuously improving the comprehensive properties of the solder joints formed between the solders and substrates. The key issues and improvements about Sn-Cu-X (X=Ni, rare earths, Zn, Co, Ga, In, Bi, secondary particles etc.) solder are outlined and evaluated in this paper which compared to Sn-Cu solder. It can be summarized that by adding appropriate amounts of certain alloying elements X to Sn-Cu solder, and it is possible to tailor the properties of the solder, such as the melting and solidification behaviors, wettability, microstructure, interfacial reactions and mechanical properties of the solder. The reliability issues related to the implementation of Sn-Cu-X solder in advanced electronics system are also introduced, which indicates that further development on the Sn-Cu-X solders are to be underway. Springer Science+Business Media, LLC, 2011 Zeng Guang College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, 210016, Nanjing, People's Republic of China aut Xue Songbai College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, 210016, Nanjing, People's Republic of China aut Zhang Liang College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, 210016, Nanjing, People's Republic of China aut Gao Lili College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, 210016, Nanjing, People's Republic of China aut Journal of Materials Science: Materials in Electronics Springer US; http://www.springer-ny.com 22/6(2011-06-01), 565-578 0957-4522 22:6<565 2011 22 10854 https://doi.org/10.1007/s10854-011-0291-3 text/html Onlinezugriff via DOI 1 review-article jats NATIONALLICENCE 856 40 https://doi.org/10.1007/s10854-011-0291-3 text/html Onlinezugriff via DOI NATIONALLICENCE 700 1- Zeng Guang College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, 210016, Nanjing, People's Republic of China aut NATIONALLICENCE 700 1- Xue Songbai College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, 210016, Nanjing, People's Republic of China aut NATIONALLICENCE 700 1- Zhang Liang College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, 210016, Nanjing, People's Republic of China aut NATIONALLICENCE 700 1- Gao Lili College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, 210016, Nanjing, People's Republic of China aut NATIONALLICENCE 773 0- Journal of Materials Science: Materials in Electronics Springer US; http://www.springer-ny.com 22/6(2011-06-01), 565-578 0957-4522 22:6<565 2011 22 10854 Metadata rights reserved Springer special CC-BY-NC licence nationallicence BK010053 XK010053 XK010000 NATIONALLICENCE NATIONALLICENCE NL-springer