caa a22 4500 445826614 CHVBK 20180317145301.0 cr unu---uuuuu 170323e20110601xx s 000 0 eng 10.1007/s10854-010-0192-x doi (NATIONALLICENCE)springer-10.1007/s10854-010-0192-x Properties and microstructure of Sn-9Zn lead-free solder alloy bearing Pr [Elektronische Daten] [Zhengxiang Xiao, Songbai Xue, Yuhua Hu, Huan Ye, Lili Gao, Hui Wang] In the present work, effects of trace amount of Pr on the microstructure, wettability and mechanical properties of Sn-9Zn solder were studied. The range of Pr content in Sn-9Zn solder alloys varied from 0.01 to 0.25 wt%. Test results indicate that adding appropriate amount of Pr can evidently improve the wettability and mechanical properties of the Sn-9Zn solder alloy. The Sn-9Zn-0.08Pr solder shows the best comprehensive properties compared to other solders with different Pr content. At the same time, notable changes in microstructure were found compared with the Pr-free alloy. The needle-like Zn-rich phase in the Sn-9Zn solder was refined and became more uniform. Moreover, the thickness of the IMC layer at Sn-9Zn/Cu substrate was remarkably depressed with Pr addition. Springer Science+Business Media, LLC, 2010 Xiao Zhengxiang College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, 210016, Nanjing, People's Republic of China aut Xue Songbai College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, 210016, Nanjing, People's Republic of China aut Hu Yuhua College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, 210016, Nanjing, People's Republic of China aut Ye Huan College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, 210016, Nanjing, People's Republic of China aut Gao Lili College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, 210016, Nanjing, People's Republic of China aut Wang Hui College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, 210016, Nanjing, People's Republic of China aut Journal of Materials Science: Materials in Electronics Springer US; http://www.springer-ny.com 22/6(2011-06-01), 659-665 0957-4522 22:6<659 2011 22 10854 https://doi.org/10.1007/s10854-010-0192-x text/html Onlinezugriff via DOI 1 research-article jats NATIONALLICENCE 856 40 https://doi.org/10.1007/s10854-010-0192-x text/html Onlinezugriff via DOI NATIONALLICENCE 700 1- Xiao Zhengxiang College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, 210016, Nanjing, People's Republic of China aut NATIONALLICENCE 700 1- Xue Songbai College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, 210016, Nanjing, People's Republic of China aut NATIONALLICENCE 700 1- Hu Yuhua College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, 210016, Nanjing, People's Republic of China aut NATIONALLICENCE 700 1- Ye Huan College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, 210016, Nanjing, People's Republic of China aut NATIONALLICENCE 700 1- Gao Lili College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, 210016, Nanjing, People's Republic of China aut NATIONALLICENCE 700 1- Wang Hui College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, 210016, Nanjing, People's Republic of China aut NATIONALLICENCE 773 0- Journal of Materials Science: Materials in Electronics Springer US; http://www.springer-ny.com 22/6(2011-06-01), 659-665 0957-4522 22:6<659 2011 22 10854 Metadata rights reserved Springer special CC-BY-NC licence nationallicence BK010053 XK010053 XK010000 NATIONALLICENCE NATIONALLICENCE NL-springer