caa a22 4500 445827017 CHVBK 20180317145302.0 cr unu---uuuuu 170323e20110901xx s 000 0 eng 10.1007/s10854-011-0327-8 doi (NATIONALLICENCE)springer-10.1007/s10854-011-0327-8 Effect of nano-TiO2 addition on the microstructure and bonding strengths of Sn3.5Ag0.5Cu composite solder BGA packages with immersion Sn surface finish [Elektronische Daten] [J. Leong, L. Tsao, C. Fang, C. Chu] The effects of nano-TiO2 particles on the interfacial microstructures and bonding strength of Sn3.5Ag0.5Cu composite solder joints in ball grid array packages with immersion Sn surface finishes have been investigated. Metallography reveals that addition of nano-TiO2 particle retarded wicker-Cu6Sn5 IMC formed in the Sn3.5Ag0.5Cu composite solder joints. The thickness of the interfacial intermetallic compounds of the solder joint was reduced with increased additions of nano-TiO2 particles (0.25-1.0 wt%), but further additions up to 1.25 wt% decreased the beneficial influence. This indicates that the presence of a small amount of nano-TiO2 particles is effective in suppressing the growth of the intermetallic compounds layer. In addition, the shear strength of the soldered joints was improved by larger nano-TiO2 particle additions, with the peak shear strength occurring at 1.0 wt% of nano-TiO2 particles into the Sn3.5Ag0.5Cu solder. The fracture mode also changed with increased amounts of nano-TiO2 particles. Springer Science+Business Media, LLC, 2011 Leong J. Department of Vehicle Engineering, National Pingtung University of Science and Technology, 91201, Neipu, Pingtung, Taiwan aut Tsao L. Department of Materials Engineering, National Pingtung University of Science and Technology, 1, Hseuhfu Road, 91201, Neipu, Pingtung, Taiwan aut Fang C. Department of New Materials Research and Development, China Steel Corporation, 81233, Kaohsiung, Taiwan aut Chu C. Department of Materials Engineering, National Pingtung University of Science and Technology, 1, Hseuhfu Road, 91201, Neipu, Pingtung, Taiwan aut Journal of Materials Science: Materials in Electronics Springer US; http://www.springer-ny.com 22/9(2011-09-01), 1443-1449 0957-4522 22:9<1443 2011 22 10854 https://doi.org/10.1007/s10854-011-0327-8 text/html Onlinezugriff via DOI 1 research-article jats NATIONALLICENCE 856 40 https://doi.org/10.1007/s10854-011-0327-8 text/html Onlinezugriff via DOI NATIONALLICENCE 700 1- Leong J. Department of Vehicle Engineering, National Pingtung University of Science and Technology, 91201, Neipu, Pingtung, Taiwan aut NATIONALLICENCE 700 1- Tsao L. Department of Materials Engineering, National Pingtung University of Science and Technology, 1, Hseuhfu Road, 91201, Neipu, Pingtung, Taiwan aut NATIONALLICENCE 700 1- Fang C. Department of New Materials Research and Development, China Steel Corporation, 81233, Kaohsiung, Taiwan aut NATIONALLICENCE 700 1- Chu C. Department of Materials Engineering, National Pingtung University of Science and Technology, 1, Hseuhfu Road, 91201, Neipu, Pingtung, Taiwan aut NATIONALLICENCE 773 0- Journal of Materials Science: Materials in Electronics Springer US; http://www.springer-ny.com 22/9(2011-09-01), 1443-1449 0957-4522 22:9<1443 2011 22 10854 Metadata rights reserved Springer special CC-BY-NC licence nationallicence BK010053 XK010053 XK010000 NATIONALLICENCE NATIONALLICENCE NL-springer