caa a22 4500 445827270 CHVBK 20180317145303.0 cr unu---uuuuu 170323e20110701xx s 000 0 eng 10.1007/s10854-010-0207-7 doi (NATIONALLICENCE)springer-10.1007/s10854-010-0207-7 Effect of different types of silver and epoxy systems on the properties of silver/epoxy conductive adhesives [Elektronische Daten] [S. Khairul Anuar, M. Mariatti, A. Azizan, N. Chee Mang, W. Tham] In this study, the effect of amine adduct powder (AAP) on the electrical conductivity, thermal expansion, and flexural modulus of one-part system conductive adhesives are investigated. One-part system conductive adhesives are prepared using two types of silver (silver A and silver B) and different percentage of filler loadings, 10 vol.% −40 vol.%. Silver A adhesive systems exhibit higher electrical conductivity with lower percolation thresholds, high flexural moduli, and low coefficients of thermal expansion (CTE) compared silver B adhesive systems. A comparison of the electrical conductivity and thermal expansion properties of the one part and two-part of silver A adhesives system is undertaken. The one-part silver A adhesives system shows high electrical conductivity and low CTE values compared to the two-part system. This is due to the higher cross linking density of the one-part system compared to that of the two-part system. Springer Science+Business Media, LLC, 2010 Khairul Anuar S. School of Materials & Mineral Resources Engineering, Universiti Sains Malaysia, Engineering Campus, 14300, Nibong Tebal, Seberang Perai Selatan, Penang, Malaysia aut Mariatti M. School of Materials & Mineral Resources Engineering, Universiti Sains Malaysia, Engineering Campus, 14300, Nibong Tebal, Seberang Perai Selatan, Penang, Malaysia aut Azizan A. School of Materials & Mineral Resources Engineering, Universiti Sains Malaysia, Engineering Campus, 14300, Nibong Tebal, Seberang Perai Selatan, Penang, Malaysia aut Chee Mang N. Penchem Technologies Sdn. Bhd, Bukit Minyak Industrial Park, 14000, Penang, Malaysia aut Tham W. Penchem Technologies Sdn. Bhd, Bukit Minyak Industrial Park, 14000, Penang, Malaysia aut Journal of Materials Science: Materials in Electronics Springer US; http://www.springer-ny.com 22/7(2011-07-01), 757-764 0957-4522 22:7<757 2011 22 10854 https://doi.org/10.1007/s10854-010-0207-7 text/html Onlinezugriff via DOI 1 research-article jats NATIONALLICENCE 856 40 https://doi.org/10.1007/s10854-010-0207-7 text/html Onlinezugriff via DOI NATIONALLICENCE 700 1- Khairul Anuar S. School of Materials & Mineral Resources Engineering, Universiti Sains Malaysia, Engineering Campus, 14300, Nibong Tebal, Seberang Perai Selatan, Penang, Malaysia aut NATIONALLICENCE 700 1- Mariatti M. School of Materials & Mineral Resources Engineering, Universiti Sains Malaysia, Engineering Campus, 14300, Nibong Tebal, Seberang Perai Selatan, Penang, Malaysia aut NATIONALLICENCE 700 1- Azizan A. School of Materials & Mineral Resources Engineering, Universiti Sains Malaysia, Engineering Campus, 14300, Nibong Tebal, Seberang Perai Selatan, Penang, Malaysia aut NATIONALLICENCE 700 1- Chee Mang N. Penchem Technologies Sdn. Bhd, Bukit Minyak Industrial Park, 14000, Penang, Malaysia aut NATIONALLICENCE 700 1- Tham W. Penchem Technologies Sdn. Bhd, Bukit Minyak Industrial Park, 14000, Penang, Malaysia aut NATIONALLICENCE 773 0- Journal of Materials Science: Materials in Electronics Springer US; http://www.springer-ny.com 22/7(2011-07-01), 757-764 0957-4522 22:7<757 2011 22 10854 Metadata rights reserved Springer special CC-BY-NC licence nationallicence BK010053 XK010053 XK010000 NATIONALLICENCE NATIONALLICENCE NL-springer