caa a22 4500 445827319 CHVBK 20180317145303.0 cr unu---uuuuu 170323e20110701xx s 000 0 eng 10.1007/s10854-010-0214-8 doi (NATIONALLICENCE)springer-10.1007/s10854-010-0214-8 Influence of minor Ag nano-particles additions on the microstructure of Sn30Bi0.5Cu solder reacted with a Cu substrate [Elektronische Daten] [Changfei Peng, Jun Shen, Weidong Xie, Jie Chen, Cuiping Wu, Xiaochuan Wang] The objective of this paper is to study the influence of minor Ag nano-particles additions on the microstructural evolution of Sn30Bi0.5Cu lead-free solder matrices and the interfacial reactions. Ag nano-particle reinforced SnBiCu-xAg (x=1, 2, 5) composite solder pastes were prepared by a mechanical mixing method and then were reflowed on Cu substrates. Three cooling methods (furnace cooling, air cooling and water cooling) were adopted in this study. Microstructural evolution of composite solder matrices and the intermetallic compound (IMC) layers formed in solder joints were investigated by microstructural observation and phase analysis. The addition of Ag nano-particles did not change the microstructure of solder matrices apparently both in the furnace cooled and water cooled samples. In the air cooled samples, Bi-rich grains were refined in the composite solder matrices due to the adsorption of Ag3Sn micro-particles on them. The growth of Cu6Sn5 IMC layers in air cooled SnBiCu-xAg/Cu solder joints was influenced by the adsorption of Ag3Sn micro-particles both on the surface of Cu6Sn5 layers and on the surface of the Bi-rich grains. Springer Science+Business Media, LLC, 2010 Peng Changfei College of Material Science & Engineering, Chongqing University, 400044, Chongqing, China aut Shen Jun College of Material Science & Engineering, Chongqing University, 400044, Chongqing, China aut Xie Weidong College of Material Science & Engineering, Chongqing University, 400044, Chongqing, China aut Chen Jie College of Material Science & Engineering, Chongqing University, 400044, Chongqing, China aut Wu Cuiping College of Material Science & Engineering, Chongqing University, 400044, Chongqing, China aut Wang Xiaochuan College of Material Science & Engineering, Chongqing University, 400044, Chongqing, China aut Journal of Materials Science: Materials in Electronics Springer US; http://www.springer-ny.com 22/7(2011-07-01), 797-806 0957-4522 22:7<797 2011 22 10854 https://doi.org/10.1007/s10854-010-0214-8 text/html Onlinezugriff via DOI 1 research-article jats NATIONALLICENCE 856 40 https://doi.org/10.1007/s10854-010-0214-8 text/html Onlinezugriff via DOI NATIONALLICENCE 700 1- Peng Changfei College of Material Science & Engineering, Chongqing University, 400044, Chongqing, China aut NATIONALLICENCE 700 1- Shen Jun College of Material Science & Engineering, Chongqing University, 400044, Chongqing, China aut NATIONALLICENCE 700 1- Xie Weidong College of Material Science & Engineering, Chongqing University, 400044, Chongqing, China aut NATIONALLICENCE 700 1- Chen Jie College of Material Science & Engineering, Chongqing University, 400044, Chongqing, China aut NATIONALLICENCE 700 1- Wu Cuiping College of Material Science & Engineering, Chongqing University, 400044, Chongqing, China aut NATIONALLICENCE 700 1- Wang Xiaochuan College of Material Science & Engineering, Chongqing University, 400044, Chongqing, China aut NATIONALLICENCE 773 0- Journal of Materials Science: Materials in Electronics Springer US; http://www.springer-ny.com 22/7(2011-07-01), 797-806 0957-4522 22:7<797 2011 22 10854 Metadata rights reserved Springer special CC-BY-NC licence nationallicence BK010053 XK010053 XK010000 NATIONALLICENCE NATIONALLICENCE NL-springer