caa a22 4500 445827335 CHVBK 20180317145303.0 cr unu---uuuuu 170323e20110701xx s 000 0 eng 10.1007/s10854-010-0213-9 doi (NATIONALLICENCE)springer-10.1007/s10854-010-0213-9 Effects of different kinds of seed layers and heat treatment on adhesion characteristics of Cu/(Cr or Ni-Cr)/PI interfaces in flexible printed circuits [Elektronische Daten] [Bo-In Noh, Jeong-Won Yoon, Bo-Young Lee, Seung-Boo Jung] In this study, the effect of various seed layers (95Ni-5Cr, 80Ni-20Cr and Cr) on the adhesion strength of flexible copper clad laminate (FCCL), which was manufactured by the roll-to-roll process, was evaluated after heat treatment. The changes in the morphology, chemical bonding, and adhesion properties were characterized by scanning electron microscopy (SEM), atomic force microscopy (AFM), X-ray photoelectron spectroscopy (XPS), and a 90° peel test. The results showed that both the peel strength and thermal resistance of the FCCL increased as the Cr ratio of the seed layer increased. The roughness of the fracture surface decreased as the heat treatment temperature and holding time increased. The heat treatment of the FCCL increased the proportion of C-N bonds and reduced that of the C-O and carbonyl (C=O) bonds in the polyimide. The chemical function and roughness of the fracture surface were affected by the composition and ratio of the seed layer. Therefore, the adhesion strength between the metal and polyimide was mostly attributed to the chemical interaction between the metal layer and the functional groups of the polyimide. Springer Science+Business Media, LLC, 2010 Noh Bo-In School of Advanced Materials Science and Engineering, Sungkyunkwan University, 300 Cheoncheon-dong, 440-746, Jangan-gu, Suwon, Gyeonggi-do, Republic of Korea aut Yoon Jeong-Won School of Advanced Materials Science and Engineering, Sungkyunkwan University, 300 Cheoncheon-dong, 440-746, Jangan-gu, Suwon, Gyeonggi-do, Republic of Korea aut Lee Bo-Young School of Aerospace and Mechanical Engineering, Korea Aerospace University, 100 Hanggongdae gil, 412-791, Hwajeon-dong, Deogyang-gu, Goyang, Gyeonggi-do, Republic of Korea aut Jung Seung-Boo School of Advanced Materials Science and Engineering, Sungkyunkwan University, 300 Cheoncheon-dong, 440-746, Jangan-gu, Suwon, Gyeonggi-do, Republic of Korea aut Journal of Materials Science: Materials in Electronics Springer US; http://www.springer-ny.com 22/7(2011-07-01), 790-796 0957-4522 22:7<790 2011 22 10854 https://doi.org/10.1007/s10854-010-0213-9 text/html Onlinezugriff via DOI 1 research-article jats NATIONALLICENCE 856 40 https://doi.org/10.1007/s10854-010-0213-9 text/html Onlinezugriff via DOI NATIONALLICENCE 700 1- Noh Bo-In School of Advanced Materials Science and Engineering, Sungkyunkwan University, 300 Cheoncheon-dong, 440-746, Jangan-gu, Suwon, Gyeonggi-do, Republic of Korea aut NATIONALLICENCE 700 1- Yoon Jeong-Won School of Advanced Materials Science and Engineering, Sungkyunkwan University, 300 Cheoncheon-dong, 440-746, Jangan-gu, Suwon, Gyeonggi-do, Republic of Korea aut NATIONALLICENCE 700 1- Lee Bo-Young School of Aerospace and Mechanical Engineering, Korea Aerospace University, 100 Hanggongdae gil, 412-791, Hwajeon-dong, Deogyang-gu, Goyang, Gyeonggi-do, Republic of Korea aut NATIONALLICENCE 700 1- Jung Seung-Boo School of Advanced Materials Science and Engineering, Sungkyunkwan University, 300 Cheoncheon-dong, 440-746, Jangan-gu, Suwon, Gyeonggi-do, Republic of Korea aut NATIONALLICENCE 773 0- Journal of Materials Science: Materials in Electronics Springer US; http://www.springer-ny.com 22/7(2011-07-01), 790-796 0957-4522 22:7<790 2011 22 10854 Metadata rights reserved Springer special CC-BY-NC licence nationallicence BK010053 XK010053 XK010000 NATIONALLICENCE NATIONALLICENCE NL-springer