caa a22 4500 44582736X CHVBK 20180317145303.0 cr unu---uuuuu 170323e20110701xx s 000 0 eng 10.1007/s10854-010-0202-z doi (NATIONALLICENCE)springer-10.1007/s10854-010-0202-z Electrical reliability of different alloying content on copper alloy fillers in electrically conductive adhesives [Elektronische Daten] [Li-Ngee Ho, Teng Wu, Hiroshi Nishikawa, Tadashi Takemoto, Koichi Miyake, Masakazu Fujita, Koyu Ota] The thermal stability and electrical reliability of electrically conductive adhesives (ECAs) filled with Cu fillers alloying with different amount of Ag and Mg (0.2-1.5 at.%), respectively, were studied by comparing their electrical resistivity under high temperature exposure at 125 and 85°C/85% RH for 1,000h. Results showed that the Cu-Ag filled ECAs were superior to Cu-Mg filled ECAs in terms of thermal stability during aging under high temperature exposure and high humidity condition. A final resistivity on the order of 10−4Ω.cm could be maintained for Cu-Ag filled ECAs after aging at 125°C for 1,000h. Cu-Mg filled ECAs showed relatively high electrical resistivity compared to Cu-Ag filled ECAs. Resistivity of Cu-Mg filled ECAs increased rapidly over time during high temperature exposure at 125°C except for Cu-0.5 at.% Mg filled ECA which was thermally stable after 400h of aging. The ECAs in this study could withstand high temperature exposure at 125°C better than aging under a combination of elevated temperature and high humidity at 85°C/85% RH. Springer Science+Business Media, LLC, 2010 Ho Li-Ngee Joining and Welding Research Institute, Osaka University, 11-1 Mihogaoka, Ibaraki, 567-0047, Osaka, Japan aut Wu Teng Graduate School of Engineering, Osaka University, 2-1 Yamadaoka, Suita, 565-0871, Osaka, Japan aut Nishikawa Hiroshi Joining and Welding Research Institute, Osaka University, 11-1 Mihogaoka, Ibaraki, 567-0047, Osaka, Japan aut Takemoto Tadashi Joining and Welding Research Institute, Osaka University, 11-1 Mihogaoka, Ibaraki, 567-0047, Osaka, Japan aut Miyake Koichi Mitsui Mining & Smelting Co. Ltd. Corporate R & D Center, 1333-2 Haraichi, 362-0021, Ageo, Saitama, Japan aut Fujita Masakazu Mitsui Mining & Smelting Co. Ltd. Corporate R & D Center, 1333-2 Haraichi, 362-0021, Ageo, Saitama, Japan aut Ota Koyu Kamioka Mining & Smelting Co. Ltd, 1-1, Shikama, Kamioka, Hida, 506-1114, Gifu, Japan aut Journal of Materials Science: Materials in Electronics Springer US; http://www.springer-ny.com 22/7(2011-07-01), 735-740 0957-4522 22:7<735 2011 22 10854 https://doi.org/10.1007/s10854-010-0202-z text/html Onlinezugriff via DOI 1 research-article jats NATIONALLICENCE 856 40 https://doi.org/10.1007/s10854-010-0202-z text/html Onlinezugriff via DOI NATIONALLICENCE 700 1- Ho Li-Ngee Joining and Welding Research Institute, Osaka University, 11-1 Mihogaoka, Ibaraki, 567-0047, Osaka, Japan aut NATIONALLICENCE 700 1- Wu Teng Graduate School of Engineering, Osaka University, 2-1 Yamadaoka, Suita, 565-0871, Osaka, Japan aut NATIONALLICENCE 700 1- Nishikawa Hiroshi Joining and Welding Research Institute, Osaka University, 11-1 Mihogaoka, Ibaraki, 567-0047, Osaka, Japan aut NATIONALLICENCE 700 1- Takemoto Tadashi Joining and Welding Research Institute, Osaka University, 11-1 Mihogaoka, Ibaraki, 567-0047, Osaka, Japan aut NATIONALLICENCE 700 1- Miyake Koichi Mitsui Mining & Smelting Co. Ltd. Corporate R & D Center, 1333-2 Haraichi, 362-0021, Ageo, Saitama, Japan aut NATIONALLICENCE 700 1- Fujita Masakazu Mitsui Mining & Smelting Co. Ltd. Corporate R & D Center, 1333-2 Haraichi, 362-0021, Ageo, Saitama, Japan aut NATIONALLICENCE 700 1- Ota Koyu Kamioka Mining & Smelting Co. Ltd, 1-1, Shikama, Kamioka, Hida, 506-1114, Gifu, Japan aut NATIONALLICENCE 773 0- Journal of Materials Science: Materials in Electronics Springer US; http://www.springer-ny.com 22/7(2011-07-01), 735-740 0957-4522 22:7<735 2011 22 10854 Metadata rights reserved Springer special CC-BY-NC licence nationallicence BK010053 XK010053 XK010000 NATIONALLICENCE NATIONALLICENCE NL-springer