caa a22 4500 445827432 CHVBK 20180317145303.0 cr unu---uuuuu 170323e20110701xx s 000 0 eng 10.1007/s10854-010-0204-x doi (NATIONALLICENCE)springer-10.1007/s10854-010-0204-x Effect of adding Ce on interfacial reactions between Sn-Ag solder and Cu [Elektronische Daten] [Jeong-Won Yoon, Bo-In Noh, Jung-Hyun Choi, Seung-Boo Jung] We investigated the effect of adding cerium (Ce) to low Ag content Sn-1.0wt.%Ag solder on the interfacial reactions between the Sn-1.0Ag solder and Cu substrate. The formation and growth of interfacial intermetallic compounds (IMCs) between the Sn-1.0Ag-0.3Ce solder and Cu substrate were studied and the results were compared to those obtained for the Ce-free Sn-1.0Ag/Cu and most promising Sn-3.0Ag-0.5Cu/Cu systems. The addition of Ce to the Sn-Ag solder significantly reduced the growth of the interfacial Cu-Sn IMCs, retarded the interfacial reactions between the solder and the substrate, and prevented the IMC from spalling from the interface. The Sn-1.0Ag-0.3Ce solder alloy had a good interfacial stability with the Cu substrate during solid-state isothermal aging in the viewpoint of IMC growth. Springer Science+Business Media, LLC, 2010 Yoon Jeong-Won School of Advanced Materials Science and Engineering, Sungkyunkwan University, 300 Cheoncheon-dong, Jangan-gu, 440-746, Suwon, Gyeonggi-do, Republic of Korea aut Noh Bo-In School of Advanced Materials Science and Engineering, Sungkyunkwan University, 300 Cheoncheon-dong, Jangan-gu, 440-746, Suwon, Gyeonggi-do, Republic of Korea aut Choi Jung-Hyun School of Advanced Materials Science and Engineering, Sungkyunkwan University, 300 Cheoncheon-dong, Jangan-gu, 440-746, Suwon, Gyeonggi-do, Republic of Korea aut Jung Seung-Boo School of Advanced Materials Science and Engineering, Sungkyunkwan University, 300 Cheoncheon-dong, Jangan-gu, 440-746, Suwon, Gyeonggi-do, Republic of Korea aut Journal of Materials Science: Materials in Electronics Springer US; http://www.springer-ny.com 22/7(2011-07-01), 745-750 0957-4522 22:7<745 2011 22 10854 https://doi.org/10.1007/s10854-010-0204-x text/html Onlinezugriff via DOI 1 research-article jats NATIONALLICENCE 856 40 https://doi.org/10.1007/s10854-010-0204-x text/html Onlinezugriff via DOI NATIONALLICENCE 700 1- Yoon Jeong-Won School of Advanced Materials Science and Engineering, Sungkyunkwan University, 300 Cheoncheon-dong, Jangan-gu, 440-746, Suwon, Gyeonggi-do, Republic of Korea aut NATIONALLICENCE 700 1- Noh Bo-In School of Advanced Materials Science and Engineering, Sungkyunkwan University, 300 Cheoncheon-dong, Jangan-gu, 440-746, Suwon, Gyeonggi-do, Republic of Korea aut NATIONALLICENCE 700 1- Choi Jung-Hyun School of Advanced Materials Science and Engineering, Sungkyunkwan University, 300 Cheoncheon-dong, Jangan-gu, 440-746, Suwon, Gyeonggi-do, Republic of Korea aut NATIONALLICENCE 700 1- Jung Seung-Boo School of Advanced Materials Science and Engineering, Sungkyunkwan University, 300 Cheoncheon-dong, Jangan-gu, 440-746, Suwon, Gyeonggi-do, Republic of Korea aut NATIONALLICENCE 773 0- Journal of Materials Science: Materials in Electronics Springer US; http://www.springer-ny.com 22/7(2011-07-01), 745-750 0957-4522 22:7<745 2011 22 10854 Metadata rights reserved Springer special CC-BY-NC licence nationallicence BK010053 XK010053 XK010000 NATIONALLICENCE NATIONALLICENCE NL-springer