caa a22 4500 445827793 CHVBK 20180317145304.0 cr unu---uuuuu 170323e20110301xx s 000 0 eng 10.1007/s10854-010-0135-6 doi (NATIONALLICENCE)springer-10.1007/s10854-010-0135-6 Development of a Sn-Ag-Cu solder reinforced with Ni-coated carbon nanotubes [Elektronische Daten] [Y. Han, S. Nai, H. Jing, L. Xu, C. Tan, J. Wei] In this study, Ni-coated carbon nanotubes (Ni-CNTs) were incorporated into the 95.8Sn-3.5Ag-0.7Cu solder alloy using the powder metallurgy route. Up to 0.3 wt% of Ni-CNTs were successfully incorporated. The effects of Ni-CNTs on the physical, thermal and mechanical properties of Sn-Ag-Cu solder alloy were investigated. With the addition of increasing weight percentages of Ni-CNTs, the composite solders showed a corresponding decrease in density values and improved wetting properties. The thermomechanical property results showed an improvement in thermal stability for the composite solders. Mechanical characterization revealed an improvement in ultimate tensile strength (up to 12%) and 0.2% yield strength (up to 8%) with the addition of 0.05 wt% Ni-CNTs in the solder. Springer Science+Business Media, LLC, 2010 Han Y. School of Materials Science and Engineering, Tianjin University, 300072, Tianjin, China aut Nai S. Singapore Institute of Manufacturing Technology, 71 Nanyang Drive, 638075, Singapore, Singapore aut Jing H. School of Materials Science and Engineering, Tianjin University, 300072, Tianjin, China aut Xu L. School of Materials Science and Engineering, Tianjin University, 300072, Tianjin, China aut Tan C. Singapore Institute of Manufacturing Technology, 71 Nanyang Drive, 638075, Singapore, Singapore aut Wei J. Singapore Institute of Manufacturing Technology, 71 Nanyang Drive, 638075, Singapore, Singapore aut Journal of Materials Science: Materials in Electronics Springer US; http://www.springer-ny.com 22/3(2011-03-01), 315-322 0957-4522 22:3<315 2011 22 10854 https://doi.org/10.1007/s10854-010-0135-6 text/html Onlinezugriff via DOI 1 research-article jats NATIONALLICENCE 856 40 https://doi.org/10.1007/s10854-010-0135-6 text/html Onlinezugriff via DOI NATIONALLICENCE 700 1- Han Y. School of Materials Science and Engineering, Tianjin University, 300072, Tianjin, China aut NATIONALLICENCE 700 1- Nai S. Singapore Institute of Manufacturing Technology, 71 Nanyang Drive, 638075, Singapore, Singapore aut NATIONALLICENCE 700 1- Jing H. School of Materials Science and Engineering, Tianjin University, 300072, Tianjin, China aut NATIONALLICENCE 700 1- Xu L. School of Materials Science and Engineering, Tianjin University, 300072, Tianjin, China aut NATIONALLICENCE 700 1- Tan C. Singapore Institute of Manufacturing Technology, 71 Nanyang Drive, 638075, Singapore, Singapore aut NATIONALLICENCE 700 1- Wei J. Singapore Institute of Manufacturing Technology, 71 Nanyang Drive, 638075, Singapore, Singapore aut NATIONALLICENCE 773 0- Journal of Materials Science: Materials in Electronics Springer US; http://www.springer-ny.com 22/3(2011-03-01), 315-322 0957-4522 22:3<315 2011 22 10854 Metadata rights reserved Springer special CC-BY-NC licence nationallicence BK010053 XK010053 XK010000 NATIONALLICENCE NATIONALLICENCE NL-springer