caa a22 4500 445827807 CHVBK 20180317145304.0 cr unu---uuuuu 170323e20110301xx s 000 0 eng 10.1007/s10854-010-0128-5 doi (NATIONALLICENCE)springer-10.1007/s10854-010-0128-5 A novel method of reducing melting temperatures in SnAg and SnCu solder alloys [Elektronische Daten] [Rami Chukka, Suresh Telu, Bhargava NRMR, Lang Chen] With the increasing use of lead-free solder alloys in modern electronics, low melting materials are often required to protect the heat-sensitive parts during soldering operation. Alloy systems based on Sn/Cu/Ag offer more reliable solutions and address the current problems involved with soldering process. Nanoparticles melt relatively at low temperatures compared to their bulk counter parts and we introduce a robust method of synthesizing nanoscale solder pastes for wave soldering applications. Nanoparticles of Sn-3.5Ag and Sn-0.7Cu alloys were prepared with stir casting followed by mechanical attrition. The size dependent melting properties of the eutectic alloys were studied by differential scanning calorimetry technique and the results showed a reduction of 4.7 and 5.0°C melting temperatures in the alloys when reduced from bulk to 92nm and 96nm sizes respectively. The nanosize effects were also theoretically calculated and compared with experimental data. Springer Science+Business Media, LLC, 2010 Chukka Rami Department of Metallurgical Engineering, Andhra University, 530003, Visakhapatnam, India aut Telu Suresh Department of Metallurgical Engineering, Andhra University, 530003, Visakhapatnam, India aut NRMR Bhargava Department of Metallurgical Engineering, Andhra University, 530003, Visakhapatnam, India aut Chen Lang School of Materials Science and Engineering, Nanyang Technological University, 639798, Singapore, Singapore aut Journal of Materials Science: Materials in Electronics Springer US; http://www.springer-ny.com 22/3(2011-03-01), 281-285 0957-4522 22:3<281 2011 22 10854 https://doi.org/10.1007/s10854-010-0128-5 text/html Onlinezugriff via DOI 1 research-article jats NATIONALLICENCE 856 40 https://doi.org/10.1007/s10854-010-0128-5 text/html Onlinezugriff via DOI NATIONALLICENCE 700 1- Chukka Rami Department of Metallurgical Engineering, Andhra University, 530003, Visakhapatnam, India aut NATIONALLICENCE 700 1- Telu Suresh Department of Metallurgical Engineering, Andhra University, 530003, Visakhapatnam, India aut NATIONALLICENCE 700 1- NRMR Bhargava Department of Metallurgical Engineering, Andhra University, 530003, Visakhapatnam, India aut NATIONALLICENCE 700 1- Chen Lang School of Materials Science and Engineering, Nanyang Technological University, 639798, Singapore, Singapore aut NATIONALLICENCE 773 0- Journal of Materials Science: Materials in Electronics Springer US; http://www.springer-ny.com 22/3(2011-03-01), 281-285 0957-4522 22:3<281 2011 22 10854 Metadata rights reserved Springer special CC-BY-NC licence nationallicence BK010053 XK010053 XK010000 NATIONALLICENCE NATIONALLICENCE NL-springer