caa a22 4500 445827874 CHVBK 20180317145304.0 cr unu---uuuuu 170323e20110301xx s 000 0 eng 10.1007/s10854-010-0131-x doi (NATIONALLICENCE)springer-10.1007/s10854-010-0131-x Comparison of drop performance between the Sn37Pb and the Sn3.8Ag0.7Cu solder joints subjected to drop test [Elektronische Daten] [Ning Zhang, Yaowu Shi, Fu Guo, Yongping Lei, Zhidong Xia, Zhenhua Chen, Li Tian] This study was concerned with the drop performance between the Sn37Pb and the Sn3.8Ag0.7Cu (wt. %) solder joints when the specimens were subjected to drop test after soldering process. The U-notch butt-jointed specimen was adopted and a lab-designed drop tester was employed. Meanwhile, the electrical resistance values of two kinds of solder joints were measured and recorded after certain drop tests, and finally drop number versus resistance curves were plotted and compared. From the resistance variation with the drop number, it was observed that the Sn37Pb joints presented significantly higher drop performance than the Sn3.8Ag0.7Cu ones. For the Sn3.8Ag0.7Cu specimens, the average drop number before failure was approximately 15-18 and then the resistance values sharply increased. However, the average drop number of the Sn37Pb joints was over 110 and the increasing rate of the electrical resistance was smooth, which is consistent with the results of the board-level drop test. Moreover, one specimen of each kind was picked out and the microstructural observation was carried out to investigate the joint deformation behavior in the dynamic load. It was obvious that the plastic deformation capacity of the Sn37Pb joints was remarkably higher than the one of the Sn3.8Ag0.7Cu joints, proving that most of SnAgCu-based solders presented low deformation compatibility and low energy absorption. Springer Science+Business Media, LLC, 2010 Zhang Ning College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, 100124, Chaoyang District, Beijing, People's Republic of China aut Shi Yaowu College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, 100124, Chaoyang District, Beijing, People's Republic of China aut Guo Fu College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, 100124, Chaoyang District, Beijing, People's Republic of China aut Lei Yongping College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, 100124, Chaoyang District, Beijing, People's Republic of China aut Xia Zhidong College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, 100124, Chaoyang District, Beijing, People's Republic of China aut Chen Zhenhua College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, 100124, Chaoyang District, Beijing, People's Republic of China aut Tian Li R&D Center, China Building Material Test & Certification Center, 1 Guanzhuang Dongli, 100024, Chaoyang District, Beijing, People's Republic of China aut Journal of Materials Science: Materials in Electronics Springer US; http://www.springer-ny.com 22/3(2011-03-01), 292-298 0957-4522 22:3<292 2011 22 10854 https://doi.org/10.1007/s10854-010-0131-x text/html Onlinezugriff via DOI 1 research-article jats NATIONALLICENCE 856 40 https://doi.org/10.1007/s10854-010-0131-x text/html Onlinezugriff via DOI NATIONALLICENCE 700 1- Zhang Ning College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, 100124, Chaoyang District, Beijing, People's Republic of China aut NATIONALLICENCE 700 1- Shi Yaowu College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, 100124, Chaoyang District, Beijing, People's Republic of China aut NATIONALLICENCE 700 1- Guo Fu College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, 100124, Chaoyang District, Beijing, People's Republic of China aut NATIONALLICENCE 700 1- Lei Yongping College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, 100124, Chaoyang District, Beijing, People's Republic of China aut NATIONALLICENCE 700 1- Xia Zhidong College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, 100124, Chaoyang District, Beijing, People's Republic of China aut NATIONALLICENCE 700 1- Chen Zhenhua College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, 100124, Chaoyang District, Beijing, People's Republic of China aut NATIONALLICENCE 700 1- Tian Li R&D Center, China Building Material Test & Certification Center, 1 Guanzhuang Dongli, 100024, Chaoyang District, Beijing, People's Republic of China aut NATIONALLICENCE 773 0- Journal of Materials Science: Materials in Electronics Springer US; http://www.springer-ny.com 22/3(2011-03-01), 292-298 0957-4522 22:3<292 2011 22 10854 Metadata rights reserved Springer special CC-BY-NC licence nationallicence BK010053 XK010053 XK010000 NATIONALLICENCE NATIONALLICENCE NL-springer