caa a22 4500 445827920 CHVBK 20180317145304.0 cr unu---uuuuu 170323e20111001xx s 000 0 eng 10.1007/s10854-011-0457-z doi (NATIONALLICENCE)springer-10.1007/s10854-011-0457-z Innovative methodologies of circuit edit by focused ion beam (FIB) on wafer-level chip-scale-package (WLCSP) devices [Elektronische Daten] [Tao-Chi Liu, Chih Chen, Shih-Ting Liu, Ming-Lun Chang, Jandel Lin] As packaging technology advances to wafer level chip scale packaging (WLCSP) to enable reduced chip size and manufacturing cost, circuit edit has become a critical issue for the fully packaged integrated circuits (ICs). These advanced package types cannot be rebuilt on a single chip; therefore, function testing after circuit edit of WLCSP faces challenges. Furthermore, there are routings at the redistribution layer of WLCSP ICs. Circuit edit was applied on both the chip and the package level. In this paper the focused ion beam was applied to mill the organic material of the package structure to expose underlying ICs, instead of chemically destroying the packaging. Metal line cutting and conductive path deposition were also developed by a beam-based technique. These new approaches make the direct edit of electrical circuitry possible not only in ICs but also at package level. Therefore, for the debug process and for failure analysis, the WLCSP ICs have negligible damage and negligible signal integrity loss by retaining the original packaging structure. Springer Science+Business Media, LLC, 2011 Liu Tao-Chi Department of Materials Science and Engineering, National Chiao Tung University, 30010, Hsin-chu, Taiwan, ROC aut Chen Chih Department of Materials Science and Engineering, National Chiao Tung University, 30010, Hsin-chu, Taiwan, ROC aut Liu Shih-Ting Integrated Service Technology Inc., No. 19, Pu-ding Rd, 30072, Hsin-chu, Taiwan, ROC aut Chang Ming-Lun Integrated Service Technology Inc., No. 19, Pu-ding Rd, 30072, Hsin-chu, Taiwan, ROC aut Lin Jandel Integrated Service Technology Inc., No. 19, Pu-ding Rd, 30072, Hsin-chu, Taiwan, ROC aut Journal of Materials Science: Materials in Electronics Springer US; http://www.springer-ny.com 22/10(2011-10-01), 1536-1541 0957-4522 22:10<1536 2011 22 10854 https://doi.org/10.1007/s10854-011-0457-z text/html Onlinezugriff via DOI 1 research-article jats NATIONALLICENCE 856 40 https://doi.org/10.1007/s10854-011-0457-z text/html Onlinezugriff via DOI NATIONALLICENCE 700 1- Liu Tao-Chi Department of Materials Science and Engineering, National Chiao Tung University, 30010, Hsin-chu, Taiwan, ROC aut NATIONALLICENCE 700 1- Chen Chih Department of Materials Science and Engineering, National Chiao Tung University, 30010, Hsin-chu, Taiwan, ROC aut NATIONALLICENCE 700 1- Liu Shih-Ting Integrated Service Technology Inc., No. 19, Pu-ding Rd, 30072, Hsin-chu, Taiwan, ROC aut NATIONALLICENCE 700 1- Chang Ming-Lun Integrated Service Technology Inc., No. 19, Pu-ding Rd, 30072, Hsin-chu, Taiwan, ROC aut NATIONALLICENCE 700 1- Lin Jandel Integrated Service Technology Inc., No. 19, Pu-ding Rd, 30072, Hsin-chu, Taiwan, ROC aut NATIONALLICENCE 773 0- Journal of Materials Science: Materials in Electronics Springer US; http://www.springer-ny.com 22/10(2011-10-01), 1536-1541 0957-4522 22:10<1536 2011 22 10854 Metadata rights reserved Springer special CC-BY-NC licence nationallicence BK010053 XK010053 XK010000 NATIONALLICENCE NATIONALLICENCE NL-springer