caa a22 4500 445827939 CHVBK 20180317145305.0 cr unu---uuuuu 170323e20111001xx s 000 0 eng 10.1007/s10854-011-0449-z doi (NATIONALLICENCE)springer-10.1007/s10854-011-0449-z Conductive filament formation in printed circuit boards: effects of reflow conditions and flame retardants [Elektronische Daten] [Bhanu Sood, Michael Pecht] Conductive filament formation, a major cause of failures in printed circuit boards, is an electrochemical process that involves the transport of a metal through or across a nonmetallic medium under the influence of an applied electric field. With an increasing potential to market "green” electronics, environmental and health legislations, and the advent of lead-free and halogen-free initiatives, newer types of printed circuit board materials are being exposed to ever higher temperatures during solder assembly. The higher temperatures can weaken the glass-fiber bonding, thus enhancing conductive filament formation. The effects of the inclusion of halogen-free flame retardants on conductive filament formation in printed circuit boards are not completely understood. Previous studies, along with analysis and examinations conducted on printed circuit boards with failure sites that were due to conductive filament formation, have shown that the conductive path is typically formed along the delaminated fiber glass and epoxy resin interfaces. This paper is a result of a year-long study on the effects of reflow temperatures, halogen-free flame retardants, glass reinforcement weave style, and conductor spacing on times to failure due to conductive filament formation. Springer Science+Business Media, LLC, 2011 Sood Bhanu Center for Advanced Life Cycle Engineering (CALCE), University of Maryland, Room 0128, Martin Hall (Building 88), 20742, College Park, MD, USA aut Pecht Michael Center for Advanced Life Cycle Engineering (CALCE), University of Maryland, Room 1103, Engineering Lab Building, 20742, College Park, MD, USA aut Journal of Materials Science: Materials in Electronics Springer US; http://www.springer-ny.com 22/10(2011-10-01), 1602-1615 0957-4522 22:10<1602 2011 22 10854 https://doi.org/10.1007/s10854-011-0449-z text/html Onlinezugriff via DOI 1 research-article jats NATIONALLICENCE 856 40 https://doi.org/10.1007/s10854-011-0449-z text/html Onlinezugriff via DOI NATIONALLICENCE 700 1- Sood Bhanu Center for Advanced Life Cycle Engineering (CALCE), University of Maryland, Room 0128, Martin Hall (Building 88), 20742, College Park, MD, USA aut NATIONALLICENCE 700 1- Pecht Michael Center for Advanced Life Cycle Engineering (CALCE), University of Maryland, Room 1103, Engineering Lab Building, 20742, College Park, MD, USA aut NATIONALLICENCE 773 0- Journal of Materials Science: Materials in Electronics Springer US; http://www.springer-ny.com 22/10(2011-10-01), 1602-1615 0957-4522 22:10<1602 2011 22 10854 Metadata rights reserved Springer special CC-BY-NC licence nationallicence BK010053 XK010053 XK010000 NATIONALLICENCE NATIONALLICENCE NL-springer