caa a22 4500 445827955 CHVBK 20180317145305.0 cr unu---uuuuu 170323e20111001xx s 000 0 eng 10.1007/s10854-011-0451-5 doi (NATIONALLICENCE)springer-10.1007/s10854-011-0451-5 LA ICP-MS in microelectronics failure analysis [Elektronische Daten] [Zixiao Pan, Wei Wei, Fuhe Li] To keep up with the trend of integrating more functionality within lighter and smaller consumer electronics devices, the dimensions of components keep shrinking. Technologies such as high density interconnection, 3-D interconnection, system in package (SIP), and flexible circuit are becoming more commonly used. The smaller dimensions of the conductors and insulators (spacing) used in these technologies make them more sensitive to chemical contamination. Trace amounts of chemical contamination introduced during the manufacturing process or in the field can cause device failures. The failure mechanisms include inversion-induced leakage current, corrosion, and electro-chemical migration, to name a few. The complexity of materials used in a highly integrated system also poses new challenges for fault isolation and chemical characterization in failure analysis. This paper calls attention to the selection of appropriate analytical techniques in terms of spatial resolution and sensitivity, sample preparation complexity, throughput, and detection limitations. We present two failure analysis cases in which LA-ICP MS, in conjunction with other analytical techniques, was successfully used to identify the source of chemical contamination and the root cause. Springer Science+Business Media, LLC, 2011 Pan Zixiao Exponent Failure Analysis Associates, 149 Commonwealth Drive, 92025, Menlo Park, CA, USA aut Wei Wei Exponent Failure Analysis Associates, 149 Commonwealth Drive, 92025, Menlo Park, CA, USA aut Li Fuhe Air Liquide—Balazs NanoAnalysis, 46409 Landing Parkway, 94538, Fremont, CA, USA aut Journal of Materials Science: Materials in Electronics Springer US; http://www.springer-ny.com 22/10(2011-10-01), 1594-1601 0957-4522 22:10<1594 2011 22 10854 https://doi.org/10.1007/s10854-011-0451-5 text/html Onlinezugriff via DOI 1 research-article jats NATIONALLICENCE 856 40 https://doi.org/10.1007/s10854-011-0451-5 text/html Onlinezugriff via DOI NATIONALLICENCE 700 1- Pan Zixiao Exponent Failure Analysis Associates, 149 Commonwealth Drive, 92025, Menlo Park, CA, USA aut NATIONALLICENCE 700 1- Wei Wei Exponent Failure Analysis Associates, 149 Commonwealth Drive, 92025, Menlo Park, CA, USA aut NATIONALLICENCE 700 1- Li Fuhe Air Liquide—Balazs NanoAnalysis, 46409 Landing Parkway, 94538, Fremont, CA, USA aut NATIONALLICENCE 773 0- Journal of Materials Science: Materials in Electronics Springer US; http://www.springer-ny.com 22/10(2011-10-01), 1594-1601 0957-4522 22:10<1594 2011 22 10854 Metadata rights reserved Springer special CC-BY-NC licence nationallicence BK010053 XK010053 XK010000 NATIONALLICENCE NATIONALLICENCE NL-springer