caa a22 4500 445827963 CHVBK 20180317145305.0 cr unu---uuuuu 170323e20111001xx s 000 0 eng 10.1007/s10854-011-0487-6 doi (NATIONALLICENCE)springer-10.1007/s10854-011-0487-6 Extending acoustic microscopy for comprehensive failure analysis applications [Elektronische Daten] [Sebastian Brand, Peter Czurratis, Peter Hoffrogge, Dorota Temple, Dean Malta, Jason Reed, Matthias Petzold] In manufacturing of microelectronic components, non-destructive failure analysis methods are important for quality control. These non-destructive methods enable rapid defect localization which then guides micro-structural investigations involving destructive sample preparation. Scanning acoustic microscopy (SAM) is a powerful tool for the inspection of internal structures in optically opaque materials. Depth-specific information can be extracted and applied to create two- and three-dimensional images without the need for time consuming tomographic scan procedures. While traditional SAM imaging of the signal intensity is very valuable, it leaves most of the potential of acoustic microscopy unused. The aim of the current work was to develop comprehensive analysis algorithms to utilize the full potential of SAM and thus to extend the range of its applications. Examples representing different application fields were investigated in the current study. The examples include advanced flip-chip devices, bonded wafer pairs, solder tape connectors of a photovoltaic solar panel and high density chip-to-chip interconnects relevant for 3D integration. Progress achieved during this work can be divided into four categories: Signal Analysis and Parametric Imaging, Signal Analysis and Defect Evaluation, Image Processing and Resolution Enhancement and acoustic GHz microscopy (GHz-SAM). For the first three categories, data acquisition was performed using a commercially available scanning acoustic microscope equipped with several ultrasonic transducers covering the frequency range from 15 to 175MHz. In the fourth category, data acquisition was performed employing a prototype of a novel acoustic GHz microscopy tool which is currently under development into a commercial system. In the first three categories, recorded acoustic data were subjected to sophisticated algorithms operating in time, frequency and spatial domains for performing signal and image analysis. Acoustic microscopy, combined with such advanced signal and image processing algorithms, proved to be a powerful tool for non-destructive inspection. Springer Science+Business Media, LLC, 2011 Brand Sebastian Fraunhofer Institute for Mechanics of Materials IWM, Walter-Huelse-Str. 01, 06120, Halle, Saale, Germany aut Czurratis Peter PVA TePla Analytical Systems GmbH, Aalen, Germany aut Hoffrogge Peter PVA TePla Analytical Systems GmbH, Aalen, Germany aut Temple Dorota Center for Materials and Electronic Technologies, RTI International, Research Triangle Park, NC, USA aut Malta Dean Center for Materials and Electronic Technologies, RTI International, Research Triangle Park, NC, USA aut Reed Jason Center for Materials and Electronic Technologies, RTI International, Research Triangle Park, NC, USA aut Petzold Matthias Fraunhofer Institute for Mechanics of Materials IWM, Walter-Huelse-Str. 01, 06120, Halle, Saale, Germany aut Journal of Materials Science: Materials in Electronics Springer US; http://www.springer-ny.com 22/10(2011-10-01), 1580-1593 0957-4522 22:10<1580 2011 22 10854 https://doi.org/10.1007/s10854-011-0487-6 text/html Onlinezugriff via DOI 1 research-article jats NATIONALLICENCE 856 40 https://doi.org/10.1007/s10854-011-0487-6 text/html Onlinezugriff via DOI NATIONALLICENCE 700 1- Brand Sebastian Fraunhofer Institute for Mechanics of Materials IWM, Walter-Huelse-Str. 01, 06120, Halle, Saale, Germany aut NATIONALLICENCE 700 1- Czurratis Peter PVA TePla Analytical Systems GmbH, Aalen, Germany aut NATIONALLICENCE 700 1- Hoffrogge Peter PVA TePla Analytical Systems GmbH, Aalen, Germany aut NATIONALLICENCE 700 1- Temple Dorota Center for Materials and Electronic Technologies, RTI International, Research Triangle Park, NC, USA aut NATIONALLICENCE 700 1- Malta Dean Center for Materials and Electronic Technologies, RTI International, Research Triangle Park, NC, USA aut NATIONALLICENCE 700 1- Reed Jason Center for Materials and Electronic Technologies, RTI International, Research Triangle Park, NC, USA aut NATIONALLICENCE 700 1- Petzold Matthias Fraunhofer Institute for Mechanics of Materials IWM, Walter-Huelse-Str. 01, 06120, Halle, Saale, Germany aut NATIONALLICENCE 773 0- Journal of Materials Science: Materials in Electronics Springer US; http://www.springer-ny.com 22/10(2011-10-01), 1580-1593 0957-4522 22:10<1580 2011 22 10854 Metadata rights reserved Springer special CC-BY-NC licence nationallicence BK010053 XK010053 XK010000 NATIONALLICENCE NATIONALLICENCE NL-springer