<?xml version="1.0" encoding="UTF-8"?>
<collection xmlns="http://www.loc.gov/MARC21/slim">
 <record>
  <leader>     caa a22        4500</leader>
  <controlfield tag="001">44582798X</controlfield>
  <controlfield tag="003">CHVBK</controlfield>
  <controlfield tag="005">20180317145305.0</controlfield>
  <controlfield tag="007">cr unu---uuuuu</controlfield>
  <controlfield tag="008">170323e20110401xx      s     000 0 eng  </controlfield>
  <datafield tag="024" ind1="7" ind2="0">
   <subfield code="a">10.1007/s10854-010-0153-4</subfield>
   <subfield code="2">doi</subfield>
  </datafield>
  <datafield tag="035" ind1=" " ind2=" ">
   <subfield code="a">(NATIONALLICENCE)springer-10.1007/s10854-010-0153-4</subfield>
  </datafield>
  <datafield tag="245" ind1="0" ind2="0">
   <subfield code="a">Diamond electromagnetic band gap structure based on Bi(Nb0.992V0.008)O4 ceramic</subfield>
   <subfield code="h">[Elektronische Daten]</subfield>
   <subfield code="c">[Wei Dai, Hong Wang, Minjie Wang, Zhiyuan Shen, Dichen Li, Di Zhou]</subfield>
  </datafield>
  <datafield tag="520" ind1="3" ind2=" ">
   <subfield code="a">Three-dimensional (3D) diamond structure electromagnetic band gap (EBG) structures containing high-K Bi(Nb0.992V0.008)O4 (BVN) ceramic, fabricated by rapid-prototyping (RP) and gel casting methods, were investigated. The simulations based on finite element method (FEM) were employed to model the band structures. High-K Bi(Nb0.992V0.008)O4 ceramic was made into gel to cast into the diamond structure molds fabricated by rapid-prototyping method. Then the green bodies were sintered at 900°C to obtain well densified EBG samples. The transmission characteristics of the EBG structures were measured by transmission/reflection (T/R) methods using a vector network analyzer. Wide complete band gap was observed in the transmission characteristics from 10.08 to 12.59GHz and it agreed well with the simulation results, which was from 10 to 12.19GHz.</subfield>
  </datafield>
  <datafield tag="540" ind1=" " ind2=" ">
   <subfield code="a">Springer Science+Business Media, LLC, 2010</subfield>
  </datafield>
  <datafield tag="700" ind1="1" ind2=" ">
   <subfield code="a">Dai</subfield>
   <subfield code="D">Wei</subfield>
   <subfield code="u">Electronic Materials Research Laboratory, Key Lab of the Ministry of Education, Xi'an Jiaotong University, 710049, Xi'an, People's Republic of China</subfield>
   <subfield code="4">aut</subfield>
  </datafield>
  <datafield tag="700" ind1="1" ind2=" ">
   <subfield code="a">Wang</subfield>
   <subfield code="D">Hong</subfield>
   <subfield code="u">Electronic Materials Research Laboratory, Key Lab of the Ministry of Education, Xi'an Jiaotong University, 710049, Xi'an, People's Republic of China</subfield>
   <subfield code="4">aut</subfield>
  </datafield>
  <datafield tag="700" ind1="1" ind2=" ">
   <subfield code="a">Wang</subfield>
   <subfield code="D">Minjie</subfield>
   <subfield code="u">Rapid-prototyping Engineering Centre of the Ministry of Education, Xi'an Jiaotong University, 710049, Xi'an, People's Republic of China</subfield>
   <subfield code="4">aut</subfield>
  </datafield>
  <datafield tag="700" ind1="1" ind2=" ">
   <subfield code="a">Shen</subfield>
   <subfield code="D">Zhiyuan</subfield>
   <subfield code="u">Electronic Materials Research Laboratory, Key Lab of the Ministry of Education, Xi'an Jiaotong University, 710049, Xi'an, People's Republic of China</subfield>
   <subfield code="4">aut</subfield>
  </datafield>
  <datafield tag="700" ind1="1" ind2=" ">
   <subfield code="a">Li</subfield>
   <subfield code="D">Dichen</subfield>
   <subfield code="u">Rapid-prototyping Engineering Centre of the Ministry of Education, Xi'an Jiaotong University, 710049, Xi'an, People's Republic of China</subfield>
   <subfield code="4">aut</subfield>
  </datafield>
  <datafield tag="700" ind1="1" ind2=" ">
   <subfield code="a">Zhou</subfield>
   <subfield code="D">Di</subfield>
   <subfield code="u">Electronic Materials Research Laboratory, Key Lab of the Ministry of Education, Xi'an Jiaotong University, 710049, Xi'an, People's Republic of China</subfield>
   <subfield code="4">aut</subfield>
  </datafield>
  <datafield tag="773" ind1="0" ind2=" ">
   <subfield code="t">Journal of Materials Science: Materials in Electronics</subfield>
   <subfield code="d">Springer US; http://www.springer-ny.com</subfield>
   <subfield code="g">22/4(2011-04-01), 422-425</subfield>
   <subfield code="x">0957-4522</subfield>
   <subfield code="q">22:4&lt;422</subfield>
   <subfield code="1">2011</subfield>
   <subfield code="2">22</subfield>
   <subfield code="o">10854</subfield>
  </datafield>
  <datafield tag="856" ind1="4" ind2="0">
   <subfield code="u">https://doi.org/10.1007/s10854-010-0153-4</subfield>
   <subfield code="q">text/html</subfield>
   <subfield code="z">Onlinezugriff via DOI</subfield>
  </datafield>
  <datafield tag="908" ind1=" " ind2=" ">
   <subfield code="D">1</subfield>
   <subfield code="a">research-article</subfield>
   <subfield code="2">jats</subfield>
  </datafield>
  <datafield tag="950" ind1=" " ind2=" ">
   <subfield code="B">NATIONALLICENCE</subfield>
   <subfield code="P">856</subfield>
   <subfield code="E">40</subfield>
   <subfield code="u">https://doi.org/10.1007/s10854-010-0153-4</subfield>
   <subfield code="q">text/html</subfield>
   <subfield code="z">Onlinezugriff via DOI</subfield>
  </datafield>
  <datafield tag="950" ind1=" " ind2=" ">
   <subfield code="B">NATIONALLICENCE</subfield>
   <subfield code="P">700</subfield>
   <subfield code="E">1-</subfield>
   <subfield code="a">Dai</subfield>
   <subfield code="D">Wei</subfield>
   <subfield code="u">Electronic Materials Research Laboratory, Key Lab of the Ministry of Education, Xi'an Jiaotong University, 710049, Xi'an, People's Republic of China</subfield>
   <subfield code="4">aut</subfield>
  </datafield>
  <datafield tag="950" ind1=" " ind2=" ">
   <subfield code="B">NATIONALLICENCE</subfield>
   <subfield code="P">700</subfield>
   <subfield code="E">1-</subfield>
   <subfield code="a">Wang</subfield>
   <subfield code="D">Hong</subfield>
   <subfield code="u">Electronic Materials Research Laboratory, Key Lab of the Ministry of Education, Xi'an Jiaotong University, 710049, Xi'an, People's Republic of China</subfield>
   <subfield code="4">aut</subfield>
  </datafield>
  <datafield tag="950" ind1=" " ind2=" ">
   <subfield code="B">NATIONALLICENCE</subfield>
   <subfield code="P">700</subfield>
   <subfield code="E">1-</subfield>
   <subfield code="a">Wang</subfield>
   <subfield code="D">Minjie</subfield>
   <subfield code="u">Rapid-prototyping Engineering Centre of the Ministry of Education, Xi'an Jiaotong University, 710049, Xi'an, People's Republic of China</subfield>
   <subfield code="4">aut</subfield>
  </datafield>
  <datafield tag="950" ind1=" " ind2=" ">
   <subfield code="B">NATIONALLICENCE</subfield>
   <subfield code="P">700</subfield>
   <subfield code="E">1-</subfield>
   <subfield code="a">Shen</subfield>
   <subfield code="D">Zhiyuan</subfield>
   <subfield code="u">Electronic Materials Research Laboratory, Key Lab of the Ministry of Education, Xi'an Jiaotong University, 710049, Xi'an, People's Republic of China</subfield>
   <subfield code="4">aut</subfield>
  </datafield>
  <datafield tag="950" ind1=" " ind2=" ">
   <subfield code="B">NATIONALLICENCE</subfield>
   <subfield code="P">700</subfield>
   <subfield code="E">1-</subfield>
   <subfield code="a">Li</subfield>
   <subfield code="D">Dichen</subfield>
   <subfield code="u">Rapid-prototyping Engineering Centre of the Ministry of Education, Xi'an Jiaotong University, 710049, Xi'an, People's Republic of China</subfield>
   <subfield code="4">aut</subfield>
  </datafield>
  <datafield tag="950" ind1=" " ind2=" ">
   <subfield code="B">NATIONALLICENCE</subfield>
   <subfield code="P">700</subfield>
   <subfield code="E">1-</subfield>
   <subfield code="a">Zhou</subfield>
   <subfield code="D">Di</subfield>
   <subfield code="u">Electronic Materials Research Laboratory, Key Lab of the Ministry of Education, Xi'an Jiaotong University, 710049, Xi'an, People's Republic of China</subfield>
   <subfield code="4">aut</subfield>
  </datafield>
  <datafield tag="950" ind1=" " ind2=" ">
   <subfield code="B">NATIONALLICENCE</subfield>
   <subfield code="P">773</subfield>
   <subfield code="E">0-</subfield>
   <subfield code="t">Journal of Materials Science: Materials in Electronics</subfield>
   <subfield code="d">Springer US; http://www.springer-ny.com</subfield>
   <subfield code="g">22/4(2011-04-01), 422-425</subfield>
   <subfield code="x">0957-4522</subfield>
   <subfield code="q">22:4&lt;422</subfield>
   <subfield code="1">2011</subfield>
   <subfield code="2">22</subfield>
   <subfield code="o">10854</subfield>
  </datafield>
  <datafield tag="900" ind1=" " ind2="7">
   <subfield code="a">Metadata rights reserved</subfield>
   <subfield code="b">Springer special CC-BY-NC licence</subfield>
   <subfield code="2">nationallicence</subfield>
  </datafield>
  <datafield tag="898" ind1=" " ind2=" ">
   <subfield code="a">BK010053</subfield>
   <subfield code="b">XK010053</subfield>
   <subfield code="c">XK010000</subfield>
  </datafield>
  <datafield tag="949" ind1=" " ind2=" ">
   <subfield code="B">NATIONALLICENCE</subfield>
   <subfield code="F">NATIONALLICENCE</subfield>
   <subfield code="b">NL-springer</subfield>
  </datafield>
 </record>
</collection>
