caa a22 4500 445828048 CHVBK 20180317145305.0 cr unu---uuuuu 170323e20110401xx s 000 0 eng 10.1007/s10854-010-0150-7 doi (NATIONALLICENCE)springer-10.1007/s10854-010-0150-7 Reliability of printed circuit boards containing lead-free solder in aggressive environments [Elektronische Daten] [M. Moshrefi-Torbati, J. Swingler] Lead-free solders were never an industry choice until government legislation, their wide spread use is still in its infancy due to long term reliability issues. A specific SAC (Tin-Silver-Copper) family of solder alloys has emerged as the favourite to offer technical advantages as well as meeting those legislative requirements. This paper investigates accelerated life behaviour of lead-free solder joints and printed circuit boards using thermal and electrical stress cycling. The aim is to understand the degradation of these materials in a practical operating environment. Whilst corrosion and debris deposits have been found, no significant evidence has been obtained for tin whiskering. EDX analysis has shown the presence of high concentrations of elements considered to arise from the packaging material. Thermal cycling tests have presented an aggressive environment to the samples and the effect on them has been supported by microscopic and macroscopic observations of debris and corrosion. The electrical behaviour, i.e., the joint resistance, has not however, significantly degraded. Springer Science+Business Media, LLC, 2010 Moshrefi-Torbati M. The Research Institute for Industry, School of Engineering Sciences, University of Southampton, SO17 1BJ, Highfield, Southampton, UK aut Swingler J. Electromechanical Research Group, School of Engineering Sciences, University of Southampton, Southampton, UK aut Journal of Materials Science: Materials in Electronics Springer US; http://www.springer-ny.com 22/4(2011-04-01), 400-411 0957-4522 22:4<400 2011 22 10854 https://doi.org/10.1007/s10854-010-0150-7 text/html Onlinezugriff via DOI 1 research-article jats NATIONALLICENCE 856 40 https://doi.org/10.1007/s10854-010-0150-7 text/html Onlinezugriff via DOI NATIONALLICENCE 700 1- Moshrefi-Torbati M. The Research Institute for Industry, School of Engineering Sciences, University of Southampton, SO17 1BJ, Highfield, Southampton, UK aut NATIONALLICENCE 700 1- Swingler J. Electromechanical Research Group, School of Engineering Sciences, University of Southampton, Southampton, UK aut NATIONALLICENCE 773 0- Journal of Materials Science: Materials in Electronics Springer US; http://www.springer-ny.com 22/4(2011-04-01), 400-411 0957-4522 22:4<400 2011 22 10854 Metadata rights reserved Springer special CC-BY-NC licence nationallicence BK010053 XK010053 XK010000 NATIONALLICENCE NATIONALLICENCE NL-springer