caa a22 4500 445828331 CHVBK 20180317145306.0 cr unu---uuuuu 170323e20110801xx s 000 0 eng 10.1007/s10854-010-0253-1 doi (NATIONALLICENCE)springer-10.1007/s10854-010-0253-1 Strengthening mechanism of nano-Al2O3 particles reinforced Sn3.5Ag0.5Cu lead-free solder [Elektronische Daten] [T. Chuang, M. Wu, S. Chang, S. Ping, L. Tsao] To improve the properties of the eutectic Sn3.5Ag0.5Cu lead-free solder, various amounts of mixed nano-Al2O3 particles were added. The microstructure, thermal analysis, density, thermal expansion coefficient (CTE), and mechanical behavior were studied. The results of differential scanning calorimetry (DSC) indicate that the melting point of the composite solder doped with nano-Al2O3 particles is slightly higher that of the Sn3.5Ag0.5Cu lead-free solder and has a eutectic peak. The Sn3.5Ag0.5Cu composite solders exhibited lower density values and thermal expansion coefficient (CTE) values than did the unreinforced solder matrix. Compared to solder without the addition of nano-Al2O3 particles, the formation of dendritic β-Sn grains, the Ag3Sn phase average size, and the spacing of lamellae decreased significantly in the composite solder matrix. The mechanical properties also improved with increasing weight percentages of nano-Al2O3 particles. However, the ductility of the Sn3.5Ag0.5Cu composite solder decreased. For the addition of 1wt% nano-Al2O3 particles, microporosity was observed both at and along the grain boundary regions, coupled with the presence of second-phase particles (i.e. nano-Al2O3 and Ag3Sn). Springer Science+Business Media, LLC, 2010 Chuang T. Department of Materials Science and Engineering, National Taiwan University, 106, Taipei, Taiwan aut Wu M. Department of Materials Science & Engineering, National Formosa University, Huwei, Yunlin 632, Taiwan aut Chang S. Department of Mechanical Engineering, National Yunlin University of Science & Technology, 64002, Touliu, Yunlin, Taiwan aut Ping S. Department of Materials Engineering, National Pingtung University of Science & Technology, 91201, Neipu, Pingtung, Taiwan aut Tsao L. Department of Materials Engineering, National Pingtung University of Science & Technology, 91201, Neipu, Pingtung, Taiwan aut Journal of Materials Science: Materials in Electronics Springer US; http://www.springer-ny.com 22/8(2011-08-01), 1021-1027 0957-4522 22:8<1021 2011 22 10854 https://doi.org/10.1007/s10854-010-0253-1 text/html Onlinezugriff via DOI 1 research-article jats NATIONALLICENCE 856 40 https://doi.org/10.1007/s10854-010-0253-1 text/html Onlinezugriff via DOI NATIONALLICENCE 700 1- Chuang T. Department of Materials Science and Engineering, National Taiwan University, 106, Taipei, Taiwan aut NATIONALLICENCE 700 1- Wu M. Department of Materials Science & Engineering, National Formosa University, Huwei, Yunlin 632, Taiwan aut NATIONALLICENCE 700 1- Chang S. Department of Mechanical Engineering, National Yunlin University of Science & Technology, 64002, Touliu, Yunlin, Taiwan aut NATIONALLICENCE 700 1- Ping S. Department of Materials Engineering, National Pingtung University of Science & Technology, 91201, Neipu, Pingtung, Taiwan aut NATIONALLICENCE 700 1- Tsao L. Department of Materials Engineering, National Pingtung University of Science & Technology, 91201, Neipu, Pingtung, Taiwan aut NATIONALLICENCE 773 0- Journal of Materials Science: Materials in Electronics Springer US; http://www.springer-ny.com 22/8(2011-08-01), 1021-1027 0957-4522 22:8<1021 2011 22 10854 Metadata rights reserved Springer special CC-BY-NC licence nationallicence BK010053 XK010053 XK010000 NATIONALLICENCE NATIONALLICENCE NL-springer