caa a22 4500 445828633 CHVBK 20180317145307.0 cr unu---uuuuu 170323e20110801xx s 000 0 eng 10.1007/s10854-010-0281-x doi (NATIONALLICENCE)springer-10.1007/s10854-010-0281-x Interfacial reactions between liquid Sn3.5Ag0.5Cu solders and Ag substrates [Elektronische Daten] [R. Wu, L. Tsao, S. Chang, C. Jain, R. Chen] The morphology and growth kinetics of intermetallic compounds (IMCs) formed during the soldering reactions between Sn3.5Ag0.5Cu and Ag substrates at various temperatures ranging from 250 to 350°C were investigated. The interfacial microstructure was quantified with scanning electron microscopy (SEM) for each processing condition. Experimental results show that the thickness of the scallop-shaped Ag3Sn IMCs layer increased with increasing soldering time and temperature. Furthermore, Cu6Sn5 particle precipitates were observed in the Ag3Sn IMCs layer around and thus suppressing the Ag3Sn IMCs layer growth. Furthermore, the large Cu6Sn5 IMCs tend to appear in the vicinity of interfacial wicker-Ag3Sn IMCs. Kinetics analyses showed that growth of the Ag3Sn intermetallic compound was diffusion controlled. The activation energies for the growth of Ag3Sn IMCs are calculated to be 66.7kJ/mol. Springer Science+Business Media, LLC, 2010 Wu R. Department of Engineering Science, National Cheng Kung University, 701, Tainan, Taiwan aut Tsao L. Department of Materials Engineering, National Pingtung, University of Science & Technology, 1, Hseuhfu road, 91201, Neipu, Pingtung, Taiwan aut Chang S. Department of Mechanical Engineering, National Yunlin University of Science & Technology, 64002, Touliu, Yunlin, Taiwan aut Jain C. Department of Materials Science and Engineering, National Taiwan University, 106, Taipei, Taiwan aut Chen R. Department of Engineering Science, National Cheng Kung University, 701, Tainan, Taiwan aut Journal of Materials Science: Materials in Electronics Springer US; http://www.springer-ny.com 22/8(2011-08-01), 1181-1187 0957-4522 22:8<1181 2011 22 10854 https://doi.org/10.1007/s10854-010-0281-x text/html Onlinezugriff via DOI 1 research-article jats NATIONALLICENCE 856 40 https://doi.org/10.1007/s10854-010-0281-x text/html Onlinezugriff via DOI NATIONALLICENCE 700 1- Wu R. Department of Engineering Science, National Cheng Kung University, 701, Tainan, Taiwan aut NATIONALLICENCE 700 1- Tsao L. Department of Materials Engineering, National Pingtung, University of Science & Technology, 1, Hseuhfu road, 91201, Neipu, Pingtung, Taiwan aut NATIONALLICENCE 700 1- Chang S. Department of Mechanical Engineering, National Yunlin University of Science & Technology, 64002, Touliu, Yunlin, Taiwan aut NATIONALLICENCE 700 1- Jain C. Department of Materials Science and Engineering, National Taiwan University, 106, Taipei, Taiwan aut NATIONALLICENCE 700 1- Chen R. Department of Engineering Science, National Cheng Kung University, 701, Tainan, Taiwan aut NATIONALLICENCE 773 0- Journal of Materials Science: Materials in Electronics Springer US; http://www.springer-ny.com 22/8(2011-08-01), 1181-1187 0957-4522 22:8<1181 2011 22 10854 Metadata rights reserved Springer special CC-BY-NC licence nationallicence BK010053 XK010053 XK010000 NATIONALLICENCE NATIONALLICENCE NL-springer