caa a22 4500 445828722 CHVBK 20180317145307.0 cr unu---uuuuu 170323e20110501xx s 000 0 eng 10.1007/s10854-010-0172-1 doi (NATIONALLICENCE)springer-10.1007/s10854-010-0172-1 Effect of dispersibility of silver powders in conductive paste on microstructure of screen-printed front contacts and electrical performance of crystalline silicon solar cells [Elektronische Daten] [Guiquan Guo, Weiping Gan, Feng Xiang, Jinling Zhang, Hua Zhou, Huan Liu, Jian Luo] Effect of dispersibility of silver powders in conductive paste on microstructure of screen-printed front contacts and electrical performance of crystalline silicon solar cells was investigated. Two different dispersed degree silver powders were experimented. It is found that the dispersibility of the silver powders strongly affects the microstructure of thick film and electrical performance of solar cells and highly dispersed silver powders can form even compact thick film and exhibit higher open-circuit voltage (V oc), short-circuit current (I sc), shunt resistance (R sh), maximum power (P max), optimum operating voltage (V mp), optimum operating current (I mp), fill factor (FF) and photoelectric conversion efficiency (Eff) than seriously agglomerated silver powders under otherwise identical conditions. Springer Science+Business Media, LLC, 2010 Guo Guiquan School of Materials Science and Engineering, Central South University, No. 932, Lushan South Road, 410083, Changsha, People's Republic of China aut Gan Weiping School of Materials Science and Engineering, Central South University, No. 932, Lushan South Road, 410083, Changsha, People's Republic of China aut Xiang Feng School of Materials Science and Engineering, Central South University, No. 932, Lushan South Road, 410083, Changsha, People's Republic of China aut Zhang Jinling School of Materials Science and Engineering, Central South University, No. 932, Lushan South Road, 410083, Changsha, People's Republic of China aut Zhou Hua School of Materials Science and Engineering, Central South University, No. 932, Lushan South Road, 410083, Changsha, People's Republic of China aut Liu Huan School of Materials Science and Engineering, Central South University, No. 932, Lushan South Road, 410083, Changsha, People's Republic of China aut Luo Jian School of Materials Science and Engineering, Central South University, No. 932, Lushan South Road, 410083, Changsha, People's Republic of China aut Journal of Materials Science: Materials in Electronics Springer US; http://www.springer-ny.com 22/5(2011-05-01), 527-530 0957-4522 22:5<527 2011 22 10854 https://doi.org/10.1007/s10854-010-0172-1 text/html Onlinezugriff via DOI 1 research-article jats NATIONALLICENCE 856 40 https://doi.org/10.1007/s10854-010-0172-1 text/html Onlinezugriff via DOI NATIONALLICENCE 700 1- Guo Guiquan School of Materials Science and Engineering, Central South University, No. 932, Lushan South Road, 410083, Changsha, People's Republic of China aut NATIONALLICENCE 700 1- Gan Weiping School of Materials Science and Engineering, Central South University, No. 932, Lushan South Road, 410083, Changsha, People's Republic of China aut NATIONALLICENCE 700 1- Xiang Feng School of Materials Science and Engineering, Central South University, No. 932, Lushan South Road, 410083, Changsha, People's Republic of China aut NATIONALLICENCE 700 1- Zhang Jinling School of Materials Science and Engineering, Central South University, No. 932, Lushan South Road, 410083, Changsha, People's Republic of China aut NATIONALLICENCE 700 1- Zhou Hua School of Materials Science and Engineering, Central South University, No. 932, Lushan South Road, 410083, Changsha, People's Republic of China aut NATIONALLICENCE 700 1- Liu Huan School of Materials Science and Engineering, Central South University, No. 932, Lushan South Road, 410083, Changsha, People's Republic of China aut NATIONALLICENCE 700 1- Luo Jian School of Materials Science and Engineering, Central South University, No. 932, Lushan South Road, 410083, Changsha, People's Republic of China aut NATIONALLICENCE 773 0- Journal of Materials Science: Materials in Electronics Springer US; http://www.springer-ny.com 22/5(2011-05-01), 527-530 0957-4522 22:5<527 2011 22 10854 Metadata rights reserved Springer special CC-BY-NC licence nationallicence BK010053 XK010053 XK010000 NATIONALLICENCE NATIONALLICENCE NL-springer