caa a22 4500 445828757 CHVBK 20180317145307.0 cr unu---uuuuu 170323e20110501xx s 000 0 eng 10.1007/s10854-010-0174-z doi (NATIONALLICENCE)springer-10.1007/s10854-010-0174-z Effect of different copper fillers on the electrical resistivity of conductive adhesives [Elektronische Daten] [Li-Ngee Ho, Hiroshi Nishikawa, Tadashi Takemoto] The effects of different copper fillers with different morphology and particle size have been studied in terms of electrical resistivity and thermal stability on the electrically conductive adhesives. The copper fillers used in this study were prepared by wet chemical reduction, electrolytic and gas atomization method, respectively. The as cured ECAs filled with different type of Cu fillers showed significant difference in electrical resistivity. Cu filler with smaller particle size showed higher packing density and larger surface area, which would enhance formation of conductive channels and increased conductive network in the ECAs, leading to a lower electrical resistivity. In addition, thermal stability of the ECAs were investigated under high temperature exposure at 125°C and high humidity aging at 85°C/85% RH for 1,000h. Results showed that ECAs with Cu fillers of relatively small particle size and rough particle surface have excellent thermal stability due to enhanced adhesion and contact area between Cu fillers and the polymer matrix. A very low resistivity at an order of magnitude of 10−4Ωcm could be maintained for these ECAs after 1,000h at 125 and 85°C/85% RH. Springer Science+Business Media, LLC, 2010 Ho Li-Ngee Joining and Welding Research Institute, Osaka University, 11-1 Mihogaoka, Ibaraki, 567-0047, Osaka, Japan aut Nishikawa Hiroshi Joining and Welding Research Institute, Osaka University, 11-1 Mihogaoka, Ibaraki, 567-0047, Osaka, Japan aut Takemoto Tadashi Joining and Welding Research Institute, Osaka University, 11-1 Mihogaoka, Ibaraki, 567-0047, Osaka, Japan aut Journal of Materials Science: Materials in Electronics Springer US; http://www.springer-ny.com 22/5(2011-05-01), 538-544 0957-4522 22:5<538 2011 22 10854 https://doi.org/10.1007/s10854-010-0174-z text/html Onlinezugriff via DOI 1 research-article jats NATIONALLICENCE 856 40 https://doi.org/10.1007/s10854-010-0174-z text/html Onlinezugriff via DOI NATIONALLICENCE 700 1- Ho Li-Ngee Joining and Welding Research Institute, Osaka University, 11-1 Mihogaoka, Ibaraki, 567-0047, Osaka, Japan aut NATIONALLICENCE 700 1- Nishikawa Hiroshi Joining and Welding Research Institute, Osaka University, 11-1 Mihogaoka, Ibaraki, 567-0047, Osaka, Japan aut NATIONALLICENCE 700 1- Takemoto Tadashi Joining and Welding Research Institute, Osaka University, 11-1 Mihogaoka, Ibaraki, 567-0047, Osaka, Japan aut NATIONALLICENCE 773 0- Journal of Materials Science: Materials in Electronics Springer US; http://www.springer-ny.com 22/5(2011-05-01), 538-544 0957-4522 22:5<538 2011 22 10854 Metadata rights reserved Springer special CC-BY-NC licence nationallicence BK010053 XK010053 XK010000 NATIONALLICENCE NATIONALLICENCE NL-springer