caa a22 4500 445829192 CHVBK 20180317145308.0 cr unu---uuuuu 170323e20111101xx s 000 0 eng 10.1007/s10854-011-0349-2 doi (NATIONALLICENCE)springer-10.1007/s10854-011-0349-2 Intermetallic reactions in a Sn-3.5Ag-1.5In solder ball-grid-array package with Au/Ni/Cu pads [Elektronische Daten] [Jie Chen, Jun Shen, Weidong Xie, Hui Liu] In this paper, the interfacial reactions between Sn-3.5Ag solder and Sn-3.5Ag-1.5In solder and Au/Ni/Cu pads in ball-grid-array (BGA) packages during solid aging were investigated by microstructural observations and phase analysis. During the solid aging, the intermetallic compound (IMC) layer in Sn-3.5Ag/Au/Ni/Cu solder joints evolved from the (Ni, Au)Sn4 phase to the Ni3Sn4 phase, but the rate of growth of the IMC layer did not change significantly. While, in Sn-3.5Ag-1.5In/Au/Ni/Cu solder joints, the phases evolved from the (Ni, Au)Sn4 and Ni3Sn4 phases into Ni3(Sn, In)4 phase. The distribution of In atoms in the solder alloy weakened interatomic force in the Sn-3.5Ag-1.5In solder alloy and the involvement of In atoms in the interfacial reaction generated more energy of distortion of the Ni3(Sn, In)4 and (Ni, Au)(Sn, In)4 lattices. These both accelerated the diffusion of Sn atoms and the rate of growth of the whole IMC layer, but this effect reduced gradually after prolonged aging. Springer Science+Business Media, LLC, 2011 Chen Jie Department of Materials Science and Engineering, Chongqing University, 400044, Chongqing, China aut Shen Jun Department of Materials Science and Engineering, Chongqing University, 400044, Chongqing, China aut Xie Weidong Department of Materials Science and Engineering, Chongqing University, 400044, Chongqing, China aut Liu Hui Chongqing Instrument Material Research Institute, 400700, Chongqing, China aut Journal of Materials Science: Materials in Electronics Springer US; http://www.springer-ny.com 22/11(2011-11-01), 1703-1708 0957-4522 22:11<1703 2011 22 10854 https://doi.org/10.1007/s10854-011-0349-2 text/html Onlinezugriff via DOI 1 research-article jats NATIONALLICENCE 856 40 https://doi.org/10.1007/s10854-011-0349-2 text/html Onlinezugriff via DOI NATIONALLICENCE 700 1- Chen Jie Department of Materials Science and Engineering, Chongqing University, 400044, Chongqing, China aut NATIONALLICENCE 700 1- Shen Jun Department of Materials Science and Engineering, Chongqing University, 400044, Chongqing, China aut NATIONALLICENCE 700 1- Xie Weidong Department of Materials Science and Engineering, Chongqing University, 400044, Chongqing, China aut NATIONALLICENCE 700 1- Liu Hui Chongqing Instrument Material Research Institute, 400700, Chongqing, China aut NATIONALLICENCE 773 0- Journal of Materials Science: Materials in Electronics Springer US; http://www.springer-ny.com 22/11(2011-11-01), 1703-1708 0957-4522 22:11<1703 2011 22 10854 Metadata rights reserved Springer special CC-BY-NC licence nationallicence BK010053 XK010053 XK010000 NATIONALLICENCE NATIONALLICENCE NL-springer