Intermetallic Compounds Formed in In-3Ag Solder BGA Packages with ENIG and ImAg Surface Finishes

Verfasser / Beitragende:
[T. Chuang, C. Jain, S. Wang]
Ort, Verlag, Jahr:
2009
Enthalten in:
Journal of Materials Engineering and Performance, 18/8(2009-11-01), 1133-1139
Format:
Artikel (online)
ID: 453629156