Interfacial Reactions and Bonding Strength of Sn- x Ag-0.5Cu/Ni BGA Solder Joints

Verfasser / Beitragende:
[K.S. Lin, H.Y. Huang, C.P. Chou]
Ort, Verlag, Jahr:
2009
Enthalten in:
Journal of Materials Engineering and Performance, 18/2(2009-03-01), 182-189
Format:
Artikel (online)
ID: 453629407