<?xml version="1.0" encoding="UTF-8"?>
<collection xmlns="http://www.loc.gov/MARC21/slim">
 <record>
  <leader>     caa a22        4500</leader>
  <controlfield tag="001">463211545</controlfield>
  <controlfield tag="003">CHVBK</controlfield>
  <controlfield tag="005">20180405153142.0</controlfield>
  <controlfield tag="007">cr unu---uuuuu</controlfield>
  <controlfield tag="008">170326e20070901xx      s     000 0 eng  </controlfield>
  <datafield tag="024" ind1="7" ind2="0">
   <subfield code="a">10.1007/s00339-007-4022-9</subfield>
   <subfield code="2">doi</subfield>
  </datafield>
  <datafield tag="035" ind1=" " ind2=" ">
   <subfield code="a">(NATIONALLICENCE)springer-10.1007/s00339-007-4022-9</subfield>
  </datafield>
  <datafield tag="245" ind1="0" ind2="0">
   <subfield code="a">Effect of thermal strain on structure and polarization fatigue of CSD-derived PbZr0.53Ti0.47O3/LaNiO3 hetero-structures</subfield>
   <subfield code="h">[Elektronische Daten]</subfield>
   <subfield code="c">[G.S. Wang, D. Rémiens, E. Dogheche, X.L. Dong]</subfield>
  </datafield>
  <datafield tag="520" ind1="3" ind2=" ">
   <subfield code="a">PbZr0.53Ti0.47O3/LaNiO3 (PZT/LNO) hetero-structures have been successfully deposited on MgO, SrTiO3, Al2O3 and Si substrate by chemical solution routes, respectively. The X-ray diffraction measurements show that out-of-plane lattice parameters of PZT increase as increase of thermal expansion coefficient of substrate. Polarization fatigues of Pt/PZT/LNO capacitors are strongly affected by the thermal strain caused by difference of thermal expansion coefficient between PZT and substrate materials. High fatigue resistance of Pt/PZT/LNO can be obtained by using substrate with similar thermal expansion coefficient as PZT.</subfield>
  </datafield>
  <datafield tag="540" ind1=" " ind2=" ">
   <subfield code="a">Springer-Verlag, 2007</subfield>
  </datafield>
  <datafield tag="700" ind1="1" ind2=" ">
   <subfield code="a">Wang</subfield>
   <subfield code="D">G.S.</subfield>
   <subfield code="u">Research Centre for Information Functional Materials and Devices, Shanghai Institute of Ceramics, Chinese Academy of Sciences, 1295 Dingxi Road, 200050, Shanghai, P.R. China</subfield>
   <subfield code="4">aut</subfield>
  </datafield>
  <datafield tag="700" ind1="1" ind2=" ">
   <subfield code="a">Rémiens</subfield>
   <subfield code="D">D.</subfield>
   <subfield code="u">Institut d'Electronique de Microélectronique et de Nanotechnologie (IEMN) (UMR-CNRS 8520), Matériaux et Intégration pour la Microélectronique et les Microsystèmes, Bat. P3, Cité scientifique, 59655, Villeneuve d'Ascq, France</subfield>
   <subfield code="4">aut</subfield>
  </datafield>
  <datafield tag="700" ind1="1" ind2=" ">
   <subfield code="a">Dogheche</subfield>
   <subfield code="D">E.</subfield>
   <subfield code="u">Institut d'Electronique de Microélectronique et de Nanotechnologie (IEMN) (UMR-CNRS 8520), Matériaux et Intégration pour la Microélectronique et les Microsystèmes, Bat. P3, Cité scientifique, 59655, Villeneuve d'Ascq, France</subfield>
   <subfield code="4">aut</subfield>
  </datafield>
  <datafield tag="700" ind1="1" ind2=" ">
   <subfield code="a">Dong</subfield>
   <subfield code="D">X.L.</subfield>
   <subfield code="u">Research Centre for Information Functional Materials and Devices, Shanghai Institute of Ceramics, Chinese Academy of Sciences, 1295 Dingxi Road, 200050, Shanghai, P.R. China</subfield>
   <subfield code="4">aut</subfield>
  </datafield>
  <datafield tag="773" ind1="0" ind2=" ">
   <subfield code="t">Applied Physics A</subfield>
   <subfield code="d">Springer-Verlag</subfield>
   <subfield code="g">88/4(2007-09-01), 657-660</subfield>
   <subfield code="x">0947-8396</subfield>
   <subfield code="q">88:4&lt;657</subfield>
   <subfield code="1">2007</subfield>
   <subfield code="2">88</subfield>
   <subfield code="o">339</subfield>
  </datafield>
  <datafield tag="856" ind1="4" ind2="0">
   <subfield code="u">https://doi.org/10.1007/s00339-007-4022-9</subfield>
   <subfield code="q">text/html</subfield>
   <subfield code="z">Onlinezugriff via DOI</subfield>
  </datafield>
  <datafield tag="908" ind1=" " ind2=" ">
   <subfield code="D">1</subfield>
   <subfield code="a">research-article</subfield>
   <subfield code="2">jats</subfield>
  </datafield>
  <datafield tag="950" ind1=" " ind2=" ">
   <subfield code="B">NATIONALLICENCE</subfield>
   <subfield code="P">856</subfield>
   <subfield code="E">40</subfield>
   <subfield code="u">https://doi.org/10.1007/s00339-007-4022-9</subfield>
   <subfield code="q">text/html</subfield>
   <subfield code="z">Onlinezugriff via DOI</subfield>
  </datafield>
  <datafield tag="950" ind1=" " ind2=" ">
   <subfield code="B">NATIONALLICENCE</subfield>
   <subfield code="P">700</subfield>
   <subfield code="E">1-</subfield>
   <subfield code="a">Wang</subfield>
   <subfield code="D">G.S.</subfield>
   <subfield code="u">Research Centre for Information Functional Materials and Devices, Shanghai Institute of Ceramics, Chinese Academy of Sciences, 1295 Dingxi Road, 200050, Shanghai, P.R. China</subfield>
   <subfield code="4">aut</subfield>
  </datafield>
  <datafield tag="950" ind1=" " ind2=" ">
   <subfield code="B">NATIONALLICENCE</subfield>
   <subfield code="P">700</subfield>
   <subfield code="E">1-</subfield>
   <subfield code="a">Rémiens</subfield>
   <subfield code="D">D.</subfield>
   <subfield code="u">Institut d'Electronique de Microélectronique et de Nanotechnologie (IEMN) (UMR-CNRS 8520), Matériaux et Intégration pour la Microélectronique et les Microsystèmes, Bat. P3, Cité scientifique, 59655, Villeneuve d'Ascq, France</subfield>
   <subfield code="4">aut</subfield>
  </datafield>
  <datafield tag="950" ind1=" " ind2=" ">
   <subfield code="B">NATIONALLICENCE</subfield>
   <subfield code="P">700</subfield>
   <subfield code="E">1-</subfield>
   <subfield code="a">Dogheche</subfield>
   <subfield code="D">E.</subfield>
   <subfield code="u">Institut d'Electronique de Microélectronique et de Nanotechnologie (IEMN) (UMR-CNRS 8520), Matériaux et Intégration pour la Microélectronique et les Microsystèmes, Bat. P3, Cité scientifique, 59655, Villeneuve d'Ascq, France</subfield>
   <subfield code="4">aut</subfield>
  </datafield>
  <datafield tag="950" ind1=" " ind2=" ">
   <subfield code="B">NATIONALLICENCE</subfield>
   <subfield code="P">700</subfield>
   <subfield code="E">1-</subfield>
   <subfield code="a">Dong</subfield>
   <subfield code="D">X.L.</subfield>
   <subfield code="u">Research Centre for Information Functional Materials and Devices, Shanghai Institute of Ceramics, Chinese Academy of Sciences, 1295 Dingxi Road, 200050, Shanghai, P.R. China</subfield>
   <subfield code="4">aut</subfield>
  </datafield>
  <datafield tag="950" ind1=" " ind2=" ">
   <subfield code="B">NATIONALLICENCE</subfield>
   <subfield code="P">773</subfield>
   <subfield code="E">0-</subfield>
   <subfield code="t">Applied Physics A</subfield>
   <subfield code="d">Springer-Verlag</subfield>
   <subfield code="g">88/4(2007-09-01), 657-660</subfield>
   <subfield code="x">0947-8396</subfield>
   <subfield code="q">88:4&lt;657</subfield>
   <subfield code="1">2007</subfield>
   <subfield code="2">88</subfield>
   <subfield code="o">339</subfield>
  </datafield>
  <datafield tag="900" ind1=" " ind2="7">
   <subfield code="a">Metadata rights reserved</subfield>
   <subfield code="b">Springer special CC-BY-NC licence</subfield>
   <subfield code="2">nationallicence</subfield>
  </datafield>
  <datafield tag="898" ind1=" " ind2=" ">
   <subfield code="a">BK010053</subfield>
   <subfield code="b">XK010053</subfield>
   <subfield code="c">XK010000</subfield>
  </datafield>
  <datafield tag="949" ind1=" " ind2=" ">
   <subfield code="B">NATIONALLICENCE</subfield>
   <subfield code="F">NATIONALLICENCE</subfield>
   <subfield code="b">NL-springer</subfield>
  </datafield>
 </record>
</collection>
