caa a22 4500 463221699 CHVBK 20180405153214.0 cr unu---uuuuu 170326e20070801xx s 000 0 eng 10.1007/s10853-007-1516-y doi (NATIONALLICENCE)springer-10.1007/s10853-007-1516-y The effect of bonding force on the electrical performance and reliability of NCA joints processed at a lowered temperature [Elektronische Daten] [Y. Ma, Y. Chan] The effect of the bonding force during flip chip-on-flex (FCOF) assembly on the electrical performance of the nonconductive adhesive (NCA) interconnects was investigated in this study, under the precondition of a reduced processing temperature in order to minimize thermally-induced damage to the low-cost flexible substrates. Pressure cooker tests (PCT) were performed to assess the reliability performance of the adhesive joints in high temperature and high humidity conditions. The assembly process was modified and the processing temperature and the bonding force were adjusted according to the experimental results to enable the use of low cost substrates, such as poly(ethylene terephthalate) (PET) materials in smart card fabrication. Springer Science+Business Media, LLC, 2007 Ma Y. Department of Electronic Engineering, City University of Hong Kong, 83 Tat Chee Avenue, Kowloon, Hong Kong aut Chan Y. Department of Electronic Engineering, City University of Hong Kong, 83 Tat Chee Avenue, Kowloon, Hong Kong aut Journal of Materials Science Kluwer Academic Publishers-Plenum Publishers; http://www.springer-ny.com 42/16(2007-08-01), 6658-6664 0022-2461 42:16<6658 2007 42 10853 https://doi.org/10.1007/s10853-007-1516-y text/html Onlinezugriff via DOI 1 research-article jats NATIONALLICENCE 856 40 https://doi.org/10.1007/s10853-007-1516-y text/html Onlinezugriff via DOI NATIONALLICENCE 700 1- Ma Y. Department of Electronic Engineering, City University of Hong Kong, 83 Tat Chee Avenue, Kowloon, Hong Kong aut NATIONALLICENCE 700 1- Chan Y. Department of Electronic Engineering, City University of Hong Kong, 83 Tat Chee Avenue, Kowloon, Hong Kong aut NATIONALLICENCE 773 0- Journal of Materials Science Kluwer Academic Publishers-Plenum Publishers; http://www.springer-ny.com 42/16(2007-08-01), 6658-6664 0022-2461 42:16<6658 2007 42 10853 Metadata rights reserved Springer special CC-BY-NC licence nationallicence BK010053 XK010053 XK010000 NATIONALLICENCE NATIONALLICENCE NL-springer