caa a22 4500 463228901 CHVBK 20180405153235.0 cr unu---uuuuu 170326e20070901xx s 000 0 eng 10.1007/s10853-006-1326-7 doi (NATIONALLICENCE)springer-10.1007/s10853-006-1326-7 Impression creep of monolithic and composite lead free solders [Elektronische Daten] [Purushotham Muthur Srinath, Pranesh Aswath] Even though several EMS (Electronic manufacturing services) companies are currently producing "lead free” products, a general notion of apprehension still exists in the industry, primarily due to the lack of sufficient mechanical reliability data supporting the use of lead free alloys. The current study was an effort to generate an understanding of the mechanisms of creep deformation in monolithic and composite (Ag and Cu reinforced) Sn-3.5Ag and Sn-3.0Ag-0.5Cu lead free alloys in the high stress high temperature regime. Small volume solder samples were reflowed using a custom built computer controlled resistance furnace. Impression creep testing was employed to determine the activation energy and stress exponent. A careful analysis of the collected data revealed the underlying creep mechanisms and the following conclusions could be made. Both Sn-3.5Ag and Sn-3.0Ag-0.5Cu exhibited higher creep resistance as compared to the eutectic tin-lead solder under all tested conditions, with the ternary lead free alloy marginally outperforming the binary lead free alloy. Composite solders performed better as compared to monolithic solders. Furthermore, Cu reinforced solders demonstrated higher creep resistance as compared to Ag reinforced solders. Springer Science+Business Media, LLC, 2007 Muthur Srinath Purushotham Materials Science and Engineering Program, University of Texas at Arlington, 500 West First Street, 76019, Arlington, TX, USA aut Aswath Pranesh Materials Science and Engineering Program, University of Texas at Arlington, 500 West First Street, 76019, Arlington, TX, USA aut Journal of Materials Science Kluwer Academic Publishers-Plenum Publishers; http://www.springer-ny.com 42/17(2007-09-01), 7592-7600 0022-2461 42:17<7592 2007 42 10853 https://doi.org/10.1007/s10853-006-1326-7 text/html Onlinezugriff via DOI 1 research-article jats NATIONALLICENCE 856 40 https://doi.org/10.1007/s10853-006-1326-7 text/html Onlinezugriff via DOI NATIONALLICENCE 700 1- Muthur Srinath Purushotham Materials Science and Engineering Program, University of Texas at Arlington, 500 West First Street, 76019, Arlington, TX, USA aut NATIONALLICENCE 700 1- Aswath Pranesh Materials Science and Engineering Program, University of Texas at Arlington, 500 West First Street, 76019, Arlington, TX, USA aut NATIONALLICENCE 773 0- Journal of Materials Science Kluwer Academic Publishers-Plenum Publishers; http://www.springer-ny.com 42/17(2007-09-01), 7592-7600 0022-2461 42:17<7592 2007 42 10853 Metadata rights reserved Springer special CC-BY-NC licence nationallicence BK010053 XK010053 XK010000 NATIONALLICENCE NATIONALLICENCE NL-springer