caa a22 4500 463229347 CHVBK 20180405153237.0 cr unu---uuuuu 170326e20070701xx s 000 0 eng 10.1007/s10853-006-0892-z doi (NATIONALLICENCE)springer-10.1007/s10853-006-0892-z Formation of bulk Cu6Sn5 intermetallic compounds in Sn-Cu lead-free solders during solidification [Elektronische Daten] [J. Shen, Y. Liu, H. Gao] The influence of cooling rate and Cu content on the microstructures of the solidified Sn-Cu alloys was investigated in terms of microstructural observation, thermal analysis and theoretical calculation. It was found that bulk Cu6Sn5 intermetalic compounds (IMCs) formed only in the Sn-1.0Cu alloy with lower cooling rate. At higher cooling rate, the actual eutectic point of Sn-Cu solder alloy shifts to the direction of higher Cu concentration. Thus the eutectic and hypereutectic alloys experience a metastable pseudoeutectic solidification route instead. The volume fraction of the bulk Cu6Sn5 IMCs formed in the Sn-1.0Cu alloy, measured by thermal analysis, is larger than that predicted by the equilibrium phase diagram. This could be attributed to eutectic Cu6Sn5 phases, which cling to the primary Cu6Sn5 crystal during the eutectic reaction due to their matching crystalline orientation relationship. Springer Science+Business Media, LLC, 2007 Shen J. College of Mechanical Engineering, Chongqing University, Chazheng street 174, 400044, Chongqing, P.R. China aut Liu Y. College of Materials Science & Engineering, Tianjin University, Weijin road 92, 300072, Tianjin, P.R. China aut Gao H. College of Materials Science & Engineering, Tianjin University, Weijin road 92, 300072, Tianjin, P.R. China aut Journal of Materials Science Kluwer Academic Publishers-Plenum Publishers; http://www.springer-ny.com 42/14(2007-07-01), 5375-5380 0022-2461 42:14<5375 2007 42 10853 https://doi.org/10.1007/s10853-006-0892-z text/html Onlinezugriff via DOI 1 research-article jats NATIONALLICENCE 856 40 https://doi.org/10.1007/s10853-006-0892-z text/html Onlinezugriff via DOI NATIONALLICENCE 700 1- Shen J. College of Mechanical Engineering, Chongqing University, Chazheng street 174, 400044, Chongqing, P.R. China aut NATIONALLICENCE 700 1- Liu Y. College of Materials Science & Engineering, Tianjin University, Weijin road 92, 300072, Tianjin, P.R. China aut NATIONALLICENCE 700 1- Gao H. College of Materials Science & Engineering, Tianjin University, Weijin road 92, 300072, Tianjin, P.R. China aut NATIONALLICENCE 773 0- Journal of Materials Science Kluwer Academic Publishers-Plenum Publishers; http://www.springer-ny.com 42/14(2007-07-01), 5375-5380 0022-2461 42:14<5375 2007 42 10853 Metadata rights reserved Springer special CC-BY-NC licence nationallicence BK010053 XK010053 XK010000 NATIONALLICENCE NATIONALLICENCE NL-springer