caa a22 4500 463230272 CHVBK 20180405153239.0 cr unu---uuuuu 170326e20070401xx s 000 0 eng 10.1007/s10853-006-1294-y doi (NATIONALLICENCE)springer-10.1007/s10853-006-1294-y Correlation between interfacial microstructure and shear behavior of Sn-Ag-Cu solder ball joined with Sn-Zn-Bi paste [Elektronische Daten] [Po-Cheng Shih, Kwang-Lung Lin] Sn-8Zn-3Bi solder paste was applied as a medium to joint Sn-3.2Ag-0.5Cu solder balls and Cu/Ni/Au metallized ball grid array substrates at 210°C. Sn-Ag-Cu joints without Sn-Zn-Bi addition were also conducted for comparison. The shear behavior of the specimens was investigated after multiple reflow and thermal aging. For each strength test, more than 40 solder balls were sheared. The shear strength of Sn-Ag-Cu specimens kept constant ranging from 15.5±1.3N (single reflow) to 16.2±1.0N (ten reflows) and the fractures occurred in the solder. Shear strength of Sn-Ag-Cu/Sn-Zn-Bi specimens fell from 15.9±1.7N (single reflow) to 13.4±1.6N (ten reflows). After single reflow, Sn-Ag-Cu/Sn-Zn-Bi specimens fractured in the solder along Ag-Au-Cu-Zn intermetallic compounds and at Ni metallization. After ten reflows, fractures occurred in the solder and at solder/Ni-Sn-Cu-Zn intermetallic compound interface. The shear strengths of the Sn-Ag-Cu and Sn-Ag-Cu/Sn-Zn-Bi packages changed little after aging at 150°C. Sn-Ag-Cu/Sn-Zn-Bi joints kept higher strength than Sn-Ag-Cu joints. Sn-Ag-Cu joints fractured in the solder after aging. But the fractures of Sn-Ag-Cu/Sn-Zn-Bi specimens shifted to the solder with aging time. Springer Science+Business Media, LLC, 2006 Shih Po-Cheng Department of Materials Science and Engineering, National Cheng-Kung University, No.1, Ta-Hsueh Road, 701, Tainan, Taiwan, R.O.C. aut Lin Kwang-Lung Department of Materials Science and Engineering, National Cheng-Kung University, No.1, Ta-Hsueh Road, 701, Tainan, Taiwan, R.O.C. aut Journal of Materials Science Kluwer Academic Publishers-Plenum Publishers; http://www.springer-ny.com 42/8(2007-04-01), 2574-2581 0022-2461 42:8<2574 2007 42 10853 https://doi.org/10.1007/s10853-006-1294-y text/html Onlinezugriff via DOI 1 research-article jats NATIONALLICENCE 856 40 https://doi.org/10.1007/s10853-006-1294-y text/html Onlinezugriff via DOI NATIONALLICENCE 700 1- Shih Po-Cheng Department of Materials Science and Engineering, National Cheng-Kung University, No.1, Ta-Hsueh Road, 701, Tainan, Taiwan, R.O.C aut NATIONALLICENCE 700 1- Lin Kwang-Lung Department of Materials Science and Engineering, National Cheng-Kung University, No.1, Ta-Hsueh Road, 701, Tainan, Taiwan, R.O.C aut NATIONALLICENCE 773 0- Journal of Materials Science Kluwer Academic Publishers-Plenum Publishers; http://www.springer-ny.com 42/8(2007-04-01), 2574-2581 0022-2461 42:8<2574 2007 42 10853 Metadata rights reserved Springer special CC-BY-NC licence nationallicence BK010053 XK010053 XK010000 NATIONALLICENCE NATIONALLICENCE NL-springer