caa a22 4500 463231597 CHVBK 20180405153243.0 cr unu---uuuuu 170326e20071201xx s 000 0 eng 10.1007/s10853-007-2016-9 doi (NATIONALLICENCE)springer-10.1007/s10853-007-2016-9 TLP bonding of SiCp/2618Al composites using mixed Al-Ag-Cu system powders as interlayers [Elektronische Daten] [Jihua Huang, Yun Wan, Hua Zhang, Xingke Zhao] Mixed Al-Ag-Cu and Al-Ag-Cu-Ti powders were used as interlayers for transient liquid phase diffusion bonding (TLP bonding) of SiC particulate reinforced 2618 aluminum alloy matrix composite (SiCp/2618Al MMC). The results show that by using mixed Al-Ag-Cu powder with the eutectic composition as an interlayer, SiCp/2618Al MMC can be TLP bonded at 540°C, however, the joining layer is porous. Adding a certain amount of titanium into the Al-Ag-Cu interlayer, the TLP bonding quality can be improved. The titanium added into the Al-Ag-Cu interlayer has an effect of shortening the solidification time of the joining layer, thus decreasing SiC particles from the parent materials entering into the joining layer. The joints bonded using Al-Ag-Cu-Ti interlayers have a maximum shear strength of 101MPa when 2.1% titanium is added. Springer Science+Business Media, LLC, 2007 Huang Jihua School of Materials Science & Engineering, University of Science & Technology Beijing, 100083, Beijing, China aut Wan Yun School of Materials Science & Engineering, University of Science & Technology Beijing, 100083, Beijing, China aut Zhang Hua School of Materials Science & Engineering, University of Science & Technology Beijing, 100083, Beijing, China aut Zhao Xingke School of Materials Science & Engineering, University of Science & Technology Beijing, 100083, Beijing, China aut Journal of Materials Science Springer US; http://www.springer-ny.com 42/23(2007-12-01), 9746-9749 0022-2461 42:23<9746 2007 42 10853 https://doi.org/10.1007/s10853-007-2016-9 text/html Onlinezugriff via DOI 1 research-article jats NATIONALLICENCE 856 40 https://doi.org/10.1007/s10853-007-2016-9 text/html Onlinezugriff via DOI NATIONALLICENCE 700 1- Huang Jihua School of Materials Science & Engineering, University of Science & Technology Beijing, 100083, Beijing, China aut NATIONALLICENCE 700 1- Wan Yun School of Materials Science & Engineering, University of Science & Technology Beijing, 100083, Beijing, China aut NATIONALLICENCE 700 1- Zhang Hua School of Materials Science & Engineering, University of Science & Technology Beijing, 100083, Beijing, China aut NATIONALLICENCE 700 1- Zhao Xingke School of Materials Science & Engineering, University of Science & Technology Beijing, 100083, Beijing, China aut NATIONALLICENCE 773 0- Journal of Materials Science Springer US; http://www.springer-ny.com 42/23(2007-12-01), 9746-9749 0022-2461 42:23<9746 2007 42 10853 Metadata rights reserved Springer special CC-BY-NC licence nationallicence BK010053 XK010053 XK010000 NATIONALLICENCE NATIONALLICENCE NL-springer