Orientation distributions by recovery behaviour in electrodeposited copper layers at room temperature

Verfasser / Beitragende:
[SV. Surnev, I. Tomov]
Ort, Verlag, Jahr:
1989
Enthalten in:
Journal of Applied Electrochemistry, 19/5(1989-09-01), 752-757
Format:
Artikel (online)
ID: 465528546