<?xml version="1.0" encoding="UTF-8"?>
<collection xmlns="http://www.loc.gov/MARC21/slim">
 <record>
  <leader>     caa a22        4500</leader>
  <controlfield tag="001">469091169</controlfield>
  <controlfield tag="003">CHVBK</controlfield>
  <controlfield tag="005">20180323133017.0</controlfield>
  <controlfield tag="007">cr unu---uuuuu</controlfield>
  <controlfield tag="008">170328e19920601xx      s     000 0 eng  </controlfield>
  <datafield tag="024" ind1="7" ind2="0">
   <subfield code="a">10.1007/BF02655427</subfield>
   <subfield code="2">doi</subfield>
  </datafield>
  <datafield tag="035" ind1=" " ind2=" ">
   <subfield code="a">(NATIONALLICENCE)springer-10.1007/BF02655427</subfield>
  </datafield>
  <datafield tag="245" ind1="0" ind2="0">
   <subfield code="a">Characterization of eutectic Sn-Bi solder joints</subfield>
   <subfield code="h">[Elektronische Daten]</subfield>
   <subfield code="c">[Z. Mei, J. Morris]</subfield>
  </datafield>
  <datafield tag="520" ind1="3" ind2=" ">
   <subfield code="a">This report presents experimental results on 58Bi-42Sn solder joints, optical and SEM microstructures of their matrix and of their interface with copper, solidification behavior studied by differential scanning calorimetry, wettability to copper, creep, and low cycle fatigue. These results are discussed in comparison with 60Sn-40Pb solder, and with three low temperature solders, 52In-48Sn, 43Sn-43Pb-14Bi, and 40In-40Sn-20Pb. The 58Bi-42Sn solder paste with RMA flux wets Cu matrix with a wetting angle of 35° and had a 15° C undercooling during solidification. The constitutive equation of the steady state shear strain rate, and the Coffin-Manson relation constants for the low cycle shear fatigue life at 65° C have been determined. The test results show that this solder has the best creep resistance but the poorest fatigue strength compared with the other four solders.</subfield>
  </datafield>
  <datafield tag="540" ind1=" " ind2=" ">
   <subfield code="a">TMS, 1992</subfield>
  </datafield>
  <datafield tag="690" ind1=" " ind2="7">
   <subfield code="a">Low temperature solders</subfield>
   <subfield code="2">nationallicence</subfield>
  </datafield>
  <datafield tag="690" ind1=" " ind2="7">
   <subfield code="a">bismuth-tin solder</subfield>
   <subfield code="2">nationallicence</subfield>
  </datafield>
  <datafield tag="700" ind1="1" ind2=" ">
   <subfield code="a">Mei</subfield>
   <subfield code="D">Z.</subfield>
   <subfield code="u">Center for Advanced Materials, Lawrence Berkeley Laboratory and Department of Materials Science and Mineral Engineering, University of California, 94720, Berkeley, CA</subfield>
   <subfield code="4">aut</subfield>
  </datafield>
  <datafield tag="700" ind1="1" ind2=" ">
   <subfield code="a">Morris</subfield>
   <subfield code="D">J.</subfield>
   <subfield code="u">Center for Advanced Materials, Lawrence Berkeley Laboratory and Department of Materials Science and Mineral Engineering, University of California, 94720, Berkeley, CA</subfield>
   <subfield code="4">aut</subfield>
  </datafield>
  <datafield tag="773" ind1="0" ind2=" ">
   <subfield code="t">Journal of Electronic Materials</subfield>
   <subfield code="d">Springer-Verlag</subfield>
   <subfield code="g">21/6(1992-06-01), 599-607</subfield>
   <subfield code="x">0361-5235</subfield>
   <subfield code="q">21:6&lt;599</subfield>
   <subfield code="1">1992</subfield>
   <subfield code="2">21</subfield>
   <subfield code="o">11664</subfield>
  </datafield>
  <datafield tag="856" ind1="4" ind2="0">
   <subfield code="u">https://doi.org/10.1007/BF02655427</subfield>
   <subfield code="q">text/html</subfield>
   <subfield code="z">Onlinezugriff via DOI</subfield>
  </datafield>
  <datafield tag="908" ind1=" " ind2=" ">
   <subfield code="D">1</subfield>
   <subfield code="a">research-article</subfield>
   <subfield code="2">jats</subfield>
  </datafield>
  <datafield tag="950" ind1=" " ind2=" ">
   <subfield code="B">NATIONALLICENCE</subfield>
   <subfield code="P">856</subfield>
   <subfield code="E">40</subfield>
   <subfield code="u">https://doi.org/10.1007/BF02655427</subfield>
   <subfield code="q">text/html</subfield>
   <subfield code="z">Onlinezugriff via DOI</subfield>
  </datafield>
  <datafield tag="950" ind1=" " ind2=" ">
   <subfield code="B">NATIONALLICENCE</subfield>
   <subfield code="P">700</subfield>
   <subfield code="E">1-</subfield>
   <subfield code="a">Mei</subfield>
   <subfield code="D">Z.</subfield>
   <subfield code="u">Center for Advanced Materials, Lawrence Berkeley Laboratory and Department of Materials Science and Mineral Engineering, University of California, 94720, Berkeley, CA</subfield>
   <subfield code="4">aut</subfield>
  </datafield>
  <datafield tag="950" ind1=" " ind2=" ">
   <subfield code="B">NATIONALLICENCE</subfield>
   <subfield code="P">700</subfield>
   <subfield code="E">1-</subfield>
   <subfield code="a">Morris</subfield>
   <subfield code="D">J.</subfield>
   <subfield code="u">Center for Advanced Materials, Lawrence Berkeley Laboratory and Department of Materials Science and Mineral Engineering, University of California, 94720, Berkeley, CA</subfield>
   <subfield code="4">aut</subfield>
  </datafield>
  <datafield tag="950" ind1=" " ind2=" ">
   <subfield code="B">NATIONALLICENCE</subfield>
   <subfield code="P">773</subfield>
   <subfield code="E">0-</subfield>
   <subfield code="t">Journal of Electronic Materials</subfield>
   <subfield code="d">Springer-Verlag</subfield>
   <subfield code="g">21/6(1992-06-01), 599-607</subfield>
   <subfield code="x">0361-5235</subfield>
   <subfield code="q">21:6&lt;599</subfield>
   <subfield code="1">1992</subfield>
   <subfield code="2">21</subfield>
   <subfield code="o">11664</subfield>
  </datafield>
  <datafield tag="900" ind1=" " ind2="7">
   <subfield code="a">Metadata rights reserved</subfield>
   <subfield code="b">Springer special CC-BY-NC licence</subfield>
   <subfield code="2">nationallicence</subfield>
  </datafield>
  <datafield tag="898" ind1=" " ind2=" ">
   <subfield code="a">BK010053</subfield>
   <subfield code="b">XK010053</subfield>
   <subfield code="c">XK010000</subfield>
  </datafield>
  <datafield tag="949" ind1=" " ind2=" ">
   <subfield code="B">NATIONALLICENCE</subfield>
   <subfield code="F">NATIONALLICENCE</subfield>
   <subfield code="b">NL-springer</subfield>
  </datafield>
 </record>
</collection>
