caa a22 4500 469091487 CHVBK 20180323133018.0 cr unu---uuuuu 170328e19920701xx s 000 0 eng 10.1007/BF02655594 doi (NATIONALLICENCE)springer-10.1007/BF02655594 Wafer bonding technology for silicon-on-lnsulator applications: A review [Elektronische Daten] [Kiyoshi Mitani, Ulrich Gösele] School of Engineering, Duke University, Durham, North Carolina, 27706. The status of wafer bonding technology especially for silicon-on-insulator (SOI) materials is reviewed. General advantages of wafer bonding as well as specific problems of wafer bonding, such as interface bubble formation, and solutions for these problems are discussed. The specific requirements for SOI materials in terms of SOI layer thickness and the appropriate thinning procedures are dealt with. Interface properties such as bonding strength and electrical properties are also reviewed. Various device results are mentioned. TMS, 1992 Wafer bonding nationallicence bonding interface nationallicence bonding strength nationallicence bubbles nationallicence silicon-oninsulator (SOI) nationallicence polish-stop nationallicence etch-stop nationallicence micro-cleanroom set-up nationallicence crack-opening method nationallicence Mitani Kiyoshi School of Engineering, Duke University, 27706, Durham, North Carolina aut Gösele Ulrich School of Engineering, Duke University, 27706, Durham, North Carolina aut Journal of Electronic Materials Springer-Verlag 21/7(1992-07-01), 669-676 0361-5235 21:7<669 1992 21 11664 https://doi.org/10.1007/BF02655594 text/html Onlinezugriff via DOI 1 research-article jats NATIONALLICENCE 856 40 https://doi.org/10.1007/BF02655594 text/html Onlinezugriff via DOI NATIONALLICENCE 700 1- Mitani Kiyoshi School of Engineering, Duke University, 27706, Durham, North Carolina aut NATIONALLICENCE 700 1- Gösele Ulrich School of Engineering, Duke University, 27706, Durham, North Carolina aut NATIONALLICENCE 773 0- Journal of Electronic Materials Springer-Verlag 21/7(1992-07-01), 669-676 0361-5235 21:7<669 1992 21 11664 Metadata rights reserved Springer special CC-BY-NC licence nationallicence BK010053 XK010053 XK010000 NATIONALLICENCE NATIONALLICENCE NL-springer