Mechanism of copper electrodeposition by pulse current and its relation to current efficiency

Verfasser / Beitragende:
[W-C. Tsai, C-C. Wan, Y-Y. Wang]
Ort, Verlag, Jahr:
2002
Enthalten in:
Journal of Applied Electrochemistry, 32/12(2002-12-01), 1371-1378
Format:
Artikel (online)
ID: 471041491