Analysis of copper grains in damascene trenches after rapid thermal processing or furnace anneals

Verfasser / Beitragende:
[Qing-Tang Jiang, Matt Nowell, Brendan Foran, Aaron Frank, R. Havemann, Vijay Parihar, R. Augur, J. Luttmer]
Ort, Verlag, Jahr:
2002
Enthalten in:
Journal of Electronic Materials, 31/1(2002-01-01), 10-15
Format:
Artikel (online)
ID: 471147060