Curing of polyimide and the effect of the TEOS SiO2 barrier layer on the electromigration of sputtered Cu with polyimide passivation

Verfasser / Beitragende:
[Hanyi Hung, Bi-Shiou Chiou]
Ort, Verlag, Jahr:
2002
Enthalten in:
Journal of Electronic Materials, 31/1(2002-01-01), 82-87
Format:
Artikel (online)
ID: 471147087