Application of an electron backscatter diffraction pattern to Cu damascene-fabricated interconnections filled by a high-pressure anneal process

Verfasser / Beitragende:
[Rika Yoda, Sumio Nakazawa, Takashi Onishi]
Ort, Verlag, Jahr:
2002
Enthalten in:
Journal of Electronic Materials, 31/1(2002-01-01), 16-22
Format:
Artikel (online)
ID: 471147125