Kinetics of intermetallic formation at Sn-37Pb/Cu interface during reflow soldering

Verfasser / Beitragende:
[Jong-Hyun Lee, Yong-Seog Kim]
Ort, Verlag, Jahr:
2002
Enthalten in:
Journal of Electronic Materials, 31/6(2002-06-01), 576-583
Format:
Artikel (online)
ID: 471147206