Phase identification and growth kinetics of the intermetallic compounds formed during in-49Sn/Cu soldering reactions
Gespeichert in:
Verfasser / Beitragende:
[T. Chuang, C. Yu, S. Chang, S. Wang]
Ort, Verlag, Jahr:
2002
Enthalten in:
Journal of Electronic Materials, 31/6(2002-06-01), 640-645
Format:
Artikel (online)
Online Zugang: