Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and Ni

Verfasser / Beitragende:
[C. Ho, R. Tsai, Y. Lin, C. Kao]
Ort, Verlag, Jahr:
2002
Enthalten in:
Journal of Electronic Materials, 31/6(2002-06-01), 584-590
Format:
Artikel (online)
ID: 471147222