The thermal property of lead-free Sn-8.55Zn-1Ag-XAl solder alloys and their wetting interaction with Cu

Verfasser / Beitragende:
[Shou Cheng, Kwang Lin]
Ort, Verlag, Jahr:
2002
Enthalten in:
Journal of Electronic Materials, 31/9(2002-09-01), 940-945
Format:
Artikel (online)
ID: 471147311